Patents by Inventor Wesley L. Meyer

Wesley L. Meyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4829319
    Abstract: A plastic orifice plate for an ink jet printhead and manufacturing process therefor which includes electroforming a metal die having raised sections thereon of predefined center-to-center spacings, and using the die to punch out openings in a plastic substrate of a chosen thickness to form a plurality of closely spaced orifice openings in the substrate. The orifice plate can be of a chosen transparent material and secured to a printhead substrate where the dynamics of ink flow can be viewed through the orifice plate during printhead testing and evaluation.
    Type: Grant
    Filed: November 13, 1987
    Date of Patent: May 9, 1989
    Assignee: Hewlett-Packard Company
    Inventors: C. S. Chan, Wesley L. Meyer, Kenneth E. Trueba
  • Patent number: 4675083
    Abstract: The present invention is directed to a compound bore nozzle plate for a thermal ink jet printhead and is manufactured by electroforming nickel onto a nickel substrate which has been masked by a plurality of mask segments of predefined geometry. This geometry consists of a plurality of base segments upon which have been formed a corresponding plurality of post segments of greater vertical dimension and smaller lateral dimension than the base segments. This mask geometry enables greater center-to-center orifice spacing to be achieved without unacceptably reducing the thickness and structural integrity of the nozzle plate.
    Type: Grant
    Filed: April 2, 1986
    Date of Patent: June 23, 1987
    Assignee: Hewlett-Packard Company
    Inventors: James G. Bearss, C. S. Chan, Wesley L. Meyer