Abstract: The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.

Abstract: In the various aspects, an optical package includes an optical connector that is at least partially configured with a first thickness that is less than a second thickness of the optical package. The optical package includes an assembly platform, a photonic integrated circuit disposed on the assembly platform, and the optical connector includes a housing with a first section and a second section, and an attachment assembly. In an aspect, the first section of the housing is disposed proximally to an edge of the assembly platform and is coupled to the photonic integrated circuit in the optical package, and the second section of the housing is coupled to a fiber optic jumper, and the attachment assembly joins the second section to the first section and enables the second section to be detached from the first section.

Abstract: Embodiments disclosed herein comprise an apparatus with a housing and a first opening at a first end of the housing and a second opening at a second end of the housing. In an embodiment, a ferrule is within the housing, and the ferrule comprises a plurality of holes. In an embodiment, a plurality of fibers are in the housing, and individual ones of the plurality of fibers are inserted into different ones of the plurality of holes in the ferrule. In an embodiment, a shim is provided across the plurality of fibers, and a third opening is in the housing, where the third opening is over the shim.

Abstract: Disclosed herein are optical connectors for connecting optical components, along with devices related to optical connectors. An example optical connector includes a body with a first connector interface, a second connector interface opposite the first connector interface, and a surface between the first and second connector interfaces. A cavity extends from the surface into the body. An opening in the body extends from the first connector interface towards the cavity. A portion of the body separates the cavity and the opening.

Abstract: An optical connector includes a body with a first connector interface and a second connector interface opposite the first connector interface. The body includes a first alignment structure and a second alignment structure, and the first and second alignment structure extend between the first connector interface and the second connector interface. The first alignment structure and the second alignment structure differ in a dimension.

Abstract: Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package comprises a photonics die and a plurality of v-grooves on the photonics die. In an embodiment, a lens array is optically coupled to a spot size converter on the photonics die. In an embodiment, the lens array comprises a main body and a plurality of lenses extending out from the main body.

Abstract: Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and the photonics die is positioned adjacent to the cutout. In an embodiment, the photonics package further comprises a receptacle for receiving a pluggable optical connector. In an embodiment, the receptacle is over the cutout.

Abstract: The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.

Abstract: The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.

Abstract: Embodiments disclosed herein include an electronic system. In an embodiment, the electronic system comprises a board, and a package substrate coupled to the board. In an embodiment, a photonics integrated circuit (PIC) is coupled to the package substrate. In an embodiment, an optical lens is on the PIC, and an optical connector is on the board. In an embodiment, the optical connector passes through an opening through the package substrate and is optically coupled with the optical lens on the PIC.

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to enable customization of pigtail lengths of optical connectors. Disclosed is an apparatus comprising an affixed fiber array unit plug including a first optical fiber, a detachable fiber array unit plug including a second optical fiber, the detachable fiber array unit plug to be removably coupled to the affixed fiber array unit plug, and guide pins to interface with both the detachable fiber array unit plug and the affixed fiber array unit plug when coupled together, the guide pins to facilitate alignment of the first optical fiber with the second optical fiber.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to a cavity created in a package substrate, where the surface of the substrate at the bottom of the cavity, or alignment features at the surface of the substrate at the bottom of the cavity are used to accurately align a lens of a FAU to a lens of a PIC. In embodiments, the surface of the substrate at the bottom of the cavity has additional standoff pedestal features to aid in height tolerance control of the FAU to properly align the FAU lens when attached. Other embodiments may be described and/or claimed.

Abstract: Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package comprises a photonics die and a plurality of v-grooves on the photonics die. In an embodiment, a lens array is optically coupled to a spot size converter on the photonics die. In an embodiment, the lens array comprises a main body and a plurality of lenses extending out from the main body.

Abstract: Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and the photonics die is positioned adjacent to the cutout. In an embodiment, the photonics package further comprises a receptacle for receiving a pluggable optical connector. In an embodiment, the receptacle is over the cutout.

Abstract: The present disclosure relates to a method including providing a die including a cavity therein, wherein the die further may include a die fiducial on a top surface. The method further includes placing a lens structure in the cavity of the die, wherein the lens structure may include a lens fiducial on a front surface. The method also includes moving the lens structure in the cavity to a position until a lens fiducial image may be captured in an image processing system when the lens fiducial and the die fiducial coincide and lie in a plane orthogonal to the top surface of the die. A corresponding system is also disclosed herein.