Abstract: Disclosed is a coating system for the selective application of coatings to substrates to apply a uniform coating to selected areas of the substrate without the need for masking. The system comprises a first coating applicator for coating large areas of the substrate, a second coating applicator for coating small areas of the substrate, a motion and positioning system for both coating applicators and a system controller. Also disclosed is an ultrasonic spray coating system comprising an ultrasonic transducer with spray forming head, integrated fluid delivery device with air and liquid supply passage ways, support brackets and an ultrasonic power generator.

Abstract: Disclosed is an ultrasonic spray coating system comprising an ultrasonic spray head with integrated fluid delivery system (IFDS), which consists of an ultrasonic transducer with a spray forming tip, an ultrasonic generator, an external liquid applicator, a precision liquid delivery system and air directors. The coating liquid is delivered to the spray forming tip on the ultrasonic transducer from an external liquid applicator. The liquid is stored in a pressurized reservoir and fed to the liquid applicator by a precision liquid delivery system. The ultrasonic vibrations of the spray forming tip break up the liquid into small droplets and propel them from the tip in the form of a spray. The spray produced with ultrasonic energy alone is a very narrow “sheet-like” pattern. The width of the spray pattern produced is equal to the width of the spray forming tip (2 mm to 4 mm). Air directors are used to produce air streams to further shape and accelerate the ultrasonically produced spray.

Abstract: Disclosed is a coating system for the selective application of coatings to substrates to apply a uniform coating to selected areas of the substrate without the need for masking. The system comprises a first coating applicator for coating large areas of the substrate, a second coating applicator for coating small areas of the substrate, a motion and positioning system for both coating applicators and a system controller. Also disclosed is an ultrasonic spray coating system comprising an ultrasonic transducer with spray forming head, integrated fluid delivery device with air and liquid supply passage ways, support brackets and an ultrasonic power generator.

Abstract: Disclosed is an ultrasonic spray coating system comprising an ultrasonic spray head with integrated fluid delivery system (IFDS), which consists of an ultrasonic transducer with a spray forming tip, an ultrasonic generator, an external liquid applicator, a precision liquid delivery system and air directors. The coating liquid is delivered to the spray forming tip on the ultrasonic transducer from an external liquid applicator. The liquid is stored in a pressurized reservoir and fed to the liquid applicator by a precision liquid delivery system. The ultrasonic vibrations of the spray forming tip break up the liquid into small droplets and propel them from the tip in the form of a spray. The spray produced with ultrasonic energy alone is a very narrow “sheet-like” pattern. The width of the spray pattern produced is equal to the width of the spray forming tip (2 mm to 4 mm). Air directors are used to produce air streams to further shape and accelerate the ultrasonically produced spray.

Abstract: A displacement soldering device having first and second ends to support, a PCB over the surface of molten solder in a container, and a support structure handling mechanism having, a first member to which said first end is pivotally attached, a latch, to which said second end is pivotally attached, moveable between latched and unlatched operational positions, said latch in its latched position being pivotally supported on said member and in its unlatched position permitting said support structure to pivot downwardly about said first end, means for lateral displacement of said support structure between a soldering position and a PCB access position, means for unlatching said latch when said solder is displaced into contact with a PCB supported by said support structure, means for latching said latch subsequent to a soldering operation, and means for elevating said support structure during said lateral displacement from said soldering position and for lowering said support structure during said lateral displacem