Abstract: The current invention relates to a system for fast and accurate filling of a two-phase cooling device, comprising a binding device (30) intended to be hermetically mounted onto the cooling device, the binding device (30) comprising a through-hole (32) able to be in fluid contact with the cooling device, said through-hole (32) being extending between a lower surface adapted to the cooling device's surface, and an essentially plane upper surface, the binding device (30) further comprising a gripping head essentially level with said upper surface, allowing for a filling tool (400) to be put in hermetic contact with said upper surface. In a preferred embodiment, the through-hole (32) can be hermetically sealed by forced insertion of a pin-shaped plug (33). The invention also relates to the filling tool (400) to be used in combination with the binding device (30), allowing gas removal from the cooling device, filling of a working fluid, and hermetic sealing of the cooling device.

Abstract: A piezo pump for use in a pressurized circuit includes a pump chamber with an inlet provided with a one way inlet valve, for connection to a feeding line of the pressurized circuit and an outlet provided with a one way outlet valve, for connection to a discharge line of the pressurized circuit and a piezo pump diaphragm closing one end of the pump chamber. A pressure chamber, which can function as a second pump chamber if desired, is defined at the side of the piezo pump diaphragm facing away from the pump chamber, wherein said pressure chamber is connected to a pressure source, which may be the feeding line.

Abstract: The current invention relates to a system for fast and accurate filling of a two-phase cooling device, comprising a binding device (30) intended to be hermetically mounted onto the cooling device, the binding device (30) comprising a through-hole (32) able to be in fluid contact with the cooling device, said through-hole (32) being extending between a lower surface adapted to the cooling device's surface, and an essentially plane upper surface, the binding device (30) further comprising a gripping head essentially level with said upper surface, allowing for a filling tool (400) to be put in hermetic contact with said upper surface. In a preferred embodiment, the through-hole (32) can be hermetically sealed by forced insertion of a pin-shaped plug (33). The invention also relates to the filling tool (400) to be used in combination with the binding device (30), allowing gas removal from the cooling device, filling of a working fluid, and hermetic sealing of the cooling device.

Abstract: Electronic circuitry includes a circuit board and at least one component mounted on the circuit board, with the at least one component generating heat while in use. The circuit board includes one or more apertures aligned with one or more respective components, and the electronic circuitry is configured to provide, while in use, a path for coolant fluid to flow through each aperture and past the respective component.

Abstract: There is disclosed an apparatus of planar heat pipe for cooling, which may be embedded in a printed circuit board for cooling of heat-dissipating components. The apparatus includes two panels that are both metal clad on one side, at least one of the panels being grooved on its metal clad side, the panels being assembled by their metal clad sides to form a sealed cavity, the cavity being filled with a fluid, the fluid circulating by capillary action along the grooves towards zones exposed to heat where it vaporizes.

Abstract: Electronic circuitry includes a circuit board and at least one component mounted on the circuit board, with the at least one component generating heat while in use. The circuit board includes one or more apertures aligned with one or more respective components, and the electronic circuitry is configured to provide, while in use, a path for coolant fluid to flow through each aperture and past the respective component.

Abstract: Electronic circuitry comprises a circuit board (34) and at least one component (30,32) mounted on the circuit board (34), wherein the at least one component (30,32) generates heat in use, the circuit board (34) includes at least one aperture (48, 50) aligned with the component (30,32) or a respective one of the components, and the electronic circuitry is configured to provide, in use, a path for coolant fluid to flow through the or each aperture (48, 50) and past the at least one component (30,32).

Abstract: Electronic circuitry comprises a circuit board (34) and at least one component (30,32) mounted on the circuit board (34), wherein the at least one component (30,32) generates heat in use, the circuit board (34) includes at least one aperture (48, 50) aligned with the component (30,32) or a respective one of the components, and the electronic circuitry is configured to provide, in use, a path for coolant fluid to flow through the or each aperture (48, 50) and past the at least one component (30,32).

Abstract: There is disclosed an apparatus of planar heat pipe for cooling, which may be embedded in a printed circuit board for cooling of heat-dissipating components. The apparatus includes two panels that are both metal clad on one side, at least one of the panels being grooved on its metal clad side, the panels being assembled by their metal clad sides to form a sealed cavity, the cavity being filled with a fluid, the fluid circulating by capillary action along the grooves towards zones exposed to heat where it vaporizes.