Patents by Inventor Wey Ngee Desmond Chin

Wey Ngee Desmond Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for soldering modules to substrates
    Patent number: 7569474
    Abstract: A method and apparatus for attaching a module such as a semiconductor device, having an array of contacts arranged thereon in a given pattern to a substrate such as a printed circuit board comprises applying an array of solder blocks to the array of contacts on the module. The module is then positioned on the substrate so that the array of solder blocks contacts the array of contact pads on the substrate. Heat is then applied to reflow the solder blocks to provide mechanical and electrical connection of the module to the substrate.
    Type: Grant
    Filed: July 7, 2006
    Date of Patent: August 4, 2009
    Assignee: Infineon Technologies AG
    Inventors: Keng Lee Teo, Wey Ngee Desmond Chin