Patents by Inventor Whan Gun Kim

Whan Gun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7667339
    Abstract: An epoxy resin composition for semiconductor encapsulation includes at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator having a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof, wherein each of R1 through R7, independently, represents a hydrogen atom or a C1-C12 hydrocarbon group, provided that when R1 through R7 are C1-C12 hydrocarbon groups, R1 and R2, R2 and R3, R3 and R4, R4 and R5, R5 and R6, and R6 and R7 can be joined to each other to form a cyclic structure.
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: February 23, 2010
    Assignee: Cheil Industries, Inc.
    Inventors: Eun Jung Lee, Yoon Kok Park, Young Kyun Lee, Whan Gun Kim, Suk Ku Chang
  • Publication number: 20070213476
    Abstract: An epoxy resin composition for semiconductor encapsulation includes at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator having a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof, wherein each of R1 through R7, independently, represents a hydrogen atom or a C1-C12 hydrocarbon group, provided that when R1 through R7 are C1-C12 hydrocarbon groups, R1 and R2, R2 and R3, R3 and R4, R4 and R5, R5 and R6, and R6 and R7 can be joined to each other to form a cyclic structure.
    Type: Application
    Filed: December 29, 2006
    Publication date: September 13, 2007
    Inventors: Eun Jung Lee, Yoon Kok Park, Young Kyun Lee, Whan Gun Kim, Suk Ku Chang