Patents by Inventor Whei Sheng TAN

Whei Sheng TAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for underfilling using spacers
    Patent number: 11948809
    Abstract: A method for underfilling an electronic circuit assembly may include mounting one or more structures to a substrate, mounting one or more spacers to the substrate at one or more positions, respectively, to form one or more passages between the one or more spacers and the one or more structures, dispensing underfill to the one or more passages, and curing the underfill to secure the one or more structures to the substrate. The one or more structures may include one or more dies.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: April 2, 2024
    Assignee: Delphi Technologies IP Limited
    Inventor: Whei Sheng Tan
  • METHOD FOR UNDERFILLING USING SPACERS
    Publication number: 20230082626
    Abstract: A method for underfilling an electronic circuit assembly may include mounting one or more structures to a substrate, mounting one or more spacers to the substrate at one or more positions, respectively, to form one or more passages between the one or more spacers and the one or more structures, dispensing underfill to the one or more passages, and curing the underfill to secure the one or more structures to the substrate. The one or more structures may include one or more dies.
    Type: Application
    Filed: September 14, 2021
    Publication date: March 16, 2023
    Applicant: Delphi Technologies IP Limited
    Inventor: Whei Sheng TAN