Patents by Inventor Whitney Enck

Whitney Enck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Headwear with pass-through slots
    Patent number: 10143254
    Abstract: An article of headwear made of a resilient material includes at least two panels that cooperate to form openings or pass-through slots through which a user may thread earbuds or headphones while maintaining coverage of the ear. The ends of the at least two panels may overlap one another. The ends of the panels may be reconfigurable between a first configuration where the panels lay flat over one another and a second configuration, where the panels are manipulated to no longer lay flat over one another to define at least one opening. One of the panels may include a non-resilient material coupled to at least one of the panels proximate to the end of the panel to aid the user in threading earbuds through the at least one opening at least partially defined by the non-resilient material.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: December 4, 2018
    Assignee: UNDER ARMOUR, INC.
    Inventors: Eric Hawes, Whitney Enck
  • HEADWEAR WITH PASS-THROUGH SLOTS
    Publication number: 20160331057
    Abstract: An article of headwear made of a resilient material includes at least two panels that cooperate to form openings or pass-through slots through which a user may thread earbuds or headphones while maintaining coverage of the ear. The ends of the at least two panels may overlap one another. The ends of the panels may be reconfigurable between a first configuration where the panels lay flat over one another and a second configuration, where the panels are manipulated to no longer lay flat over one another to define at least one opening. One of the panels may include a non-resilient material coupled to at least one of the panels proximate to the end of the panel to aid the user in threading earbuds through the at least one opening at least partially defined by the non-resilient material.
    Type: Application
    Filed: May 13, 2016
    Publication date: November 17, 2016
    Inventors: Eric Hawes, Whitney Enck
  • Glove
    Patent number: D817593
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: May 15, 2018
    Assignee: UNDER ARMOUR, INC.
    Inventors: Whitney Enck, Jodie Todd
  • Cap
    Patent number: D818247
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: May 22, 2018
    Assignee: UNDER ARMOUR, INC.
    Inventors: Eric Hawes, Whitney Enck
  • Headwear
    Patent number: D832558
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: November 6, 2018
    Assignee: UNDER ARMOUR, INC.
    Inventors: Eric Hawes, Whitney Enck