Patents by Inventor Wi-Jun Lee

Wi-Jun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and method for supporting robust header compression in wireless communication system
    Patent number: 9042339
    Abstract: A system and method support robust header compression (ROHC) for a mobile station (MS) handover in a wireless communication system. If a mobile station (MS) accesses a base station (BS) controlled by the ASN-GW through a handover, ROHC parameter information is received from a previous ASN-GW controlling a previous BS accessed by the MS before the handover. An ROHC parameter for ROHC-based communication with the MS is determined on the basis of the ROHC parameter information received from the previous ASN-GW. The determined ROHC parameter is transmitted to the MS by using a path modification request message for an ROHC service flow.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: May 26, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dae-Hee Kim, Wi-Jun Lee
  • System and method for supporting robust header compression in wireless communication system
    Publication number: 20110058530
    Abstract: A system and method support robust header compression (ROHC) for a mobile station (MS) handover in a wireless communication system. If a mobile station (MS) accesses a base station (BS) controlled by the ASN-GW through a handover, ROHC parameter information is received from a previous ASN-GW controlling a previous BS accessed by the MS before the handover. An ROHC parameter for ROHC-based communication with the MS is determined on the basis of the ROHC parameter information received from the previous ASN-GW. The determined ROHC parameter is transmitted to the MS by using a path modification request message for an ROHC service flow.
    Type: Application
    Filed: September 2, 2010
    Publication date: March 10, 2011
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Dae-Hee Kim, Wi-Jun Lee