Patents by Inventor Wia Lo

Wia Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making semiconductor package having exposed heat spreader
    Publication number: 20070122943
    Abstract: A method of making a semiconductor package (50) includes attaching a bottom surface (54) of an integrated circuit (IC) die (52) to a base carrier (56) and electrically connecting the die (52) to the base carrier (56). A first surface (66) of a heat spreader (60) is attached to a top surface (58) of the die (52). The heat spreader includes a laminate (68) attached to a second surface (70) opposite the first surface (66). The die (52), the heat spreader (60), the laminate (68) and at least a portion of the base carrier (56) are encapsulated. The laminate (68) is detached from the heat spreader (60), which exposes the second surface (70) of the heat spreader (60).
    Type: Application
    Filed: November 30, 2005
    Publication date: May 31, 2007
    Inventors: Chee Foong, Wia Lo