Abstract: A double layered, flexible thermoelectric generator with direct bonded, double layers of active materials that are directly bonded by heat curing, not soldered nor attached/bonded by an adhesive layer. The thermoelectric device is made from a first substrate and a second substrate, each including an n-type and p-type thermoelectric legs. The first and the second substrate are brought together so that the n-type and p-type thermoelectric legs of the first substrate come into direct contact with, respectively, the n-type and the p-type thermoelectric legs of the second substrate. Each thermoelectric leg may be disposed in a well formed in an insulating layer disposed over contact electrodes supported on the first and second substrate. Each thermoelectric leg may contain a particulate semiconductor and a binder, e.g. a polymer binder. The pairs of legs are bonded together by heat curing.

Abstract: A flexible thermoelectric device that includes a plurality of pairs of semiconducting legs. The pair of semiconducting legs includes an n-type thermoelectric leg and a p-type thermoelectric leg. The pairs of thermoelectric legs are positioned between two substrates and are electrically connected in series in an alternating sequence between n-type and p-type legs. Both the n-type legs and the p-type legs are made from a binder containing semiconducting materials/particles that give the legs their n-type and p-type properties, respectively. The n-type and p-type legs are directly bonded with an electrode on one of the substrates by the binder. The flexible thermoelectric device nay be fabricated by contacting the electrode with the n-type and p-type legs and curing the binder.