Abstract: An exhaust adaptor and method which includes attachment of an exhaust bellow or conduit to a process chamber to facilitate vacuum-induced evacuation of residual toxic gases from the chamber during cleaning and/or maintenance of the chamber. A throttle valve of the chamber is first removed from a throttle valve housing, and one end of the exhaust adaptor is next attached to the throttle valve housing. An exhaust bellow or conduit is attached to the opposite end of the adaptor. As a down flow of air is directed into the open chamber, vacuum pressure is induced in the chamber interior through the exhaust bellow or conduit, the adaptor and the valve housing, respectively. Air disturbances in the chamber interior are thus eliminated, and toxic residual gases generated in the chamber interior are therefore incapable of diffusing to the exterior of the chamber.

Abstract: An exhaust adaptor and method which includes attachment of an exhaust bellow or conduit to a process chamber to facilitate vacuum-induced evacuation of residual toxic gases from the chamber during cleaning and/or maintenance of the chamber. A throttle valve of the chamber is first removed from a throttle valve housing, and one end of the exhaust adaptor is next attached to the throttle valve housing. An exhaust bellow or conduit is attached to the opposite end of the adaptor. As a down flow of air is directed into the open chamber, vacuum pressure is induced in the chamber interior through the exhaust bellow or conduit, the adaptor and the valve housing, respectively. Air disturbances in the chamber interior are thus eliminated, and toxic residual gases generated in the chamber interior are therefore incapable of diffusing to the exterior of the chamber.

Abstract: The present invention provides a ventilation system and method that operates to remove outgassing of chemicals formed on a wafer during a wafer fabrication process to prevent contamination in a sealed wafer handling chamber. More particularly, the present invention discloses a ventilation system having a hood body having a gas supply conduit attached to a sealed outer side chamber of the ventilation hood such that contaminating particles in an interior of the hood are carried out by a purge gas flown into the hood interior through an inlet of the hood connected to the gas supply conduit into a facility vacuum exhaust system attached to an outlet of the hood. Preferably, the chamber is a load-lock chamber that operates to perform load lock processing on wafers and further operates to load and unload wafers to another location for further processing after using the ventilation system.