Patents by Inventor Wieland Wahrmund

Wieland Wahrmund has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7518220
    Abstract: An FBGA semiconductor component has a chip side for receiving a semiconductor chip, a solder ball side for applying solder balls on ball pads, and a bonding channel embodied as an opening between the chip side and the solder ball side and serving for leading through wire bridges between the semiconductor chip and bonding islands on the solder ball side. The bonding channel has side areas extending between the chip side and the solder ball side and can be closed off with a housing part comprising potting composition. Positively locking elements for a potting composition are arranged in that region of the substrate in which the housing part is produced.
    Type: Grant
    Filed: January 24, 2006
    Date of Patent: April 14, 2009
    Assignee: Infineon Technologies AG
    Inventors: Steffen Kroehnert, Knut Kahlisch, Wieland Wahrmund
  • Publication number: 20060180929
    Abstract: An FBGA semiconductor component has a chip side for receiving a semiconductor chip, a solder ball side for applying solder balls on ball pads, and a bonding channel embodied as an opening between the chip side and the solder ball side and serving for leading through wire bridges between the semiconductor chip and bonding islands on the solder ball side. The bonding channel has side areas extending between the chip side and the solder ball side and can be closed off with a housing part comprising potting composition. Positively locking elements for a potting composition are arranged in that region of the substrate in which the housing part is produced.
    Type: Application
    Filed: January 24, 2006
    Publication date: August 17, 2006
    Inventors: Steffen Kroehnert, Knut Kahlisch, Wieland Wahrmund