Patents by Inventor WIILIAM H. LYTLE

WIILIAM H. LYTLE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGING HAVING TWO DEVICES AND METHOD OF FORMING THEREOF
    Publication number: 20100078808
    Abstract: A method of forming a semiconductor package includes providing a carrier, attaching a first surface of a first device on the carrier, wherein the first surface comprises a first active surface of the first device, and attaching a second surface of a second device on the carrier. In one embodiment, the second surface is opposite a third surface of the second semiconductor die and the third surface comprises a second active surface. A first insulating material can be formed between the first device and the second device.
    Type: Application
    Filed: September 29, 2008
    Publication date: April 1, 2010
    Inventors: KENNETH R. BURCH, MARC A. MANGRUM, WIILIAM H. LYTLE