Abstract: A heat transfer module, comprises: a heat generating unit and a heat receiving unit which are separated by a gap; a compliant body, having microscopic voids therethrough, which is compressed into the gap; and a liquid metal alloy that is absorbed in the microscopic voids in the compliant body. Further, the heat transfer module also includes a seal ring in the gap which surrounds the compliant body and which is spaced apart from the compliant body; and, the compliant body is intentionally compressed so much that a portion of the liquid metal alloy is squeezed from the compliant body into the space between the compliant body and the seal ring. Squeezing liquid metal alloy from the compliant body lowers the thermal resistance between the heat generating unit and the heat receiving unit by increasing the area through which heat is transferred and by increasing the thermal conductivity through the compliant body.

Abstract: A sub-assembly for transferring heat between a heat generating unit and heat receiving unit which are separated by a gap, comprises: a compliant body having microscopic voids therethrough; a liquid metal alloy that is absorbed in the microscopic voids in the compliant body; a seal ring which surrounds the compliant body; and, a retaining member which is attached to the compliant body and the seal ring, and which holds the compliant body spaced apart from the seal ring. This sub-assembly is placed in the gap between the two units and compressed to the point where liquid metal alloy is squeezed out of the compliant body. Squeezing liquid metal alloy from the compliant body lowers the thermal resistance between the heat generating unit and the heat receiving unit by increasing the area through which heat is transferred and by increasing the thermal conductivity through the compliant body.

Abstract: An integrated circuit package has an integrated circuit chip, a substrate which holds the chip, and a novel heat conduction mechanism which is coupled to the chip and which provides a path for conducting heat from the chip to a fluid medium. This heat conduction mechanism is characterized as including a) a compliant body, having microscopic voids throughout, which is disposed in and fills a gap in the heat conducting path, and b) a liquid metal alloy that is absorbed by and partially fills the microscopic voids of the compliant body. Due to the presence of the liquid metal alloy, the thermal conductivity through the body is high. Also, due to the voids in the body being only partially filled with the liquid metal alloy, the body can be compressed by dimensional variations within the integrated circuit package without squeezing out any of the liquid metal alloy that is held therein.

Abstract: A leak in an enclosure of an integrated circuit package is detected by the steps of: filling the enclosure with a first gas at the time the enclosure is sealed; subsequently enveloping the integrated circuit package with a second gas that is different than the first gas; holding the second gas at a constant pressure over a certain time period; and sensing a surface of the enclosure, during the above steps, for the presence of microscopic deflections. If the enclosure has a gross leak, no deflection will occur when the package is initially enveloped with the second gas. If the package has a minor leak, a deflection will occur when the package is initially enveloped with the second gas, and the amount of the deflection will decrease during the holding time period.

Abstract: A bi level electrical inductance coil wherein flat, thin conductors are formed and supported on both sides of a flexible dielectric substrate such that the center line of the conductors on one side overlays the space between the conductors on the other side and such that both ends of each conductor are formed so as to be interdigitated; the ends on one side of the substrate interdigitated with the ends on the other side of the substrate; the substrate and conductors bent so that the conductor ends contact adjacent conductor ends to form continuous turns thus forming a relatively thin flat coil with overlapping conductors to provide a uniform magnetic field particularly useful in bubble memories.

Abstract: A method of forming an electrical coil and the coil formed thereby wherein flat, thin conductors are formed on a flexible dielectric substrate with one end of each conductor formed offset to overlie an adjacent conductor; by selectively bending the substrate, the offset conductor ends contact the adjacent conductors to form continuous turns; and by suitably trimming the conductor a relatively thin, flat coil is formed whose wall thickness is small compared to wire wound coils having the same number of turns. This coil is particularly useful in bubble memories.

Abstract: A package having bubble memory components including bubble memory chips or modules disposed between bias magnets for maintaining and establishing bubbles in said chips, field drive coils for propagating the bubbles therein and further including thermal control means for stabilizing and dissipating the heat generated in the package and which also aid in the packaging of the components. The thermal control means include discrete compliant members of thermally conductive material which also aid in the assembly of the package, additional thermal members and spacing means both also of thermally conductive material which locate the chips relative to the bias magnets.

Abstract: A package of bubble memory components including magnetic bubble memory chips or modules disposed between bias magnets for maintaining and establishing bubbles in said chips, field drive coils for propagating the bubbles established in the chips and thermal management means for stabilizing and dissipating the heat generated within the package including heat conductor means disposed adjacent to the drive coils for conducting heat therefrom and flexible heat conductor means also disposed adjacent the drive coils and flexed, sometimes folded back, toward other components of the package to control the heat of these other components thus stabilizing the temperature of the components with respect to the heat generated by the drive coils.

Abstract: A package having bubble memory components comprising an innerassembly of bubble memory chips surrounded by spaced orthogonally oriented drive coils, a printed circuit board having a rigid support portion for the chips and a flexible portion containing conductors for direct interchip communication and for direct connection to the outside world, means in the form of tapers of controlled thermally conductive material for assisting in controlling the temperatures of the bias magnets and for providing a magnetic gradient for bubble propagation, thermal compliant members, and flexible heat conductors which together with the tapers, manage the heat within the package.

Abstract: An entirely zero insertion/retraction force connector having a mechanism for receiving the conductor terminals of a device inserted therein. The connector includes means having conductor terminals which are separable by an actuating mechanism which responds to insertion of said device into the connector for receiving said device terminals without engagement between the connector terminals until the inserted device is fully positioned in the connector at which time resilient means urges the connector terminals toward one another thus electrically connecting (clamping) the device terminals therebetween. The force necessary to insert and move the inserted device to final position has no relationship to terminal contact pressure which is a function only of the force of the resilient means and in one embodiment of the invention there is no wiping force involved.