Abstract: A manually operated universal tool for straightening the leads on Dual-In-Line integrated circuit packages so they may be placed more easily into printed circuit boards and sockets. The tool as disclosed can be operated with one hand and primarily includes a split forming rail which is adjustable for the different centers of 0.300, 0.400, 0.500, and 0.600 inch wide Dual-In-Line integrated circuit packages, two forming rollers which are adjustable to adapt to the different manufacturers' thickness of leads on the integrated circuit packages, and adjustment features for adapting to the different form factors and shapes of the lateral leads which protrude outward from the integrated circuit packages, and a base plate.