Abstract: The present invention relates generally to compositions, kits and methods of providing improved semiconductor surfaces free of dangling bonds and free of strained bonds. One method provides for preventing interfacial reactions between a semiconductor surface and metal or dielectric comprising the steps of preparing a passivated semiconductor surface using a valence-mending agent and depositing a layer of metal or dielectric on the valence-mended semiconductor surface. As further described, a semiconductor surface free of interfacial reactions between the surface and a second molecular species may include a semiconductor surface with one atomic layer of valence-mending atoms, wherein valence mending occurs after introducing the semiconductor surface to a passivating agent. The present invention also includes a kit for preventing interfacial reactions from occurring on a semiconductor surface comprising a passivating agent and an instructional manual.

Abstract: The present invention relates generally to compositions and methods of improving the interface between a semiconductor material and a dielectric. One method provides for a method of improving the interface between a dielectric and a semiconductor material comprising the steps of preparing a passivated semiconductor surface using a valence-mending agent, depositing a precursor to a dielectric on the valence-mended semiconductor surface and oxidizing the precursor to a dielectric, wherein depositing and oxidizing do not damage the valence-mended semiconductor surface. The present invention also includes a semiconductor/dielectric interface with improved capacitance-voltage characteristics comprising a semiconductor substrate having at least one surface with one atomic layer of valence-mending atoms and a dielectric deposited on the semiconductor substrate.

Abstract: The present invention relates generally to compositions, kits and methods of providing improved semiconductor surfaces free of dangling bonds and free of strained bonds. One method provides for preventing interfacial reactions between a semiconductor surface and metal or dielectric comprising the steps of preparing a passivated semiconductor surface using a valence-mending agent and depositing a layer of metal or dielectric on the valence-mended semiconductor surface. As further described, a semiconductor surface free of interfacial reactions between the surface and a second molecular species may include a semiconductor surface with one atomic layer of valence-mending atoms, wherein valence mending occurs after introducing the semiconductor surface to a passivating agent. The present invention also includes a kit for preventing interfacial reactions from occurring on a semiconductor surface comprising a passivating agent and an instructional manual.

Abstract: The present invention relates generally to a method of improving the performance of solid state devices, and specifically provides methods for passivating a semiconductor surfaces with a monolayer of passivating material.

Abstract: The present invention relates generally to a method of improving the performance of solid state devices, and specifically provides methods for passivating a semiconductor surfaces with a monolayer of passivating material.

Abstract: A method of forming lattice matched single crystal wide bandgap II-VI compound semiconductor films over a silicon substrate includes first cleaning (10) the silicon substrate. A passivation layer is formed (18), which may comprise arsenic, germanium, or CaF2, among others. The lattice matched layer is then grown (26) on the passivation layer.

Abstract: An anode plate (10) for use in a field emission flat panel display device (8) includes a transparent substrate (26) having a plurality of spaced-apart, electrically conductive regions (28) are covered by a luminescent material (24) and from the anode electrode. A getter material (29) of porous silicon is deposited on the substrate (26) between the conductive regions (28) of the anode plate (10). The getter material (29) of porous silicon is preferably electrically nonconductive, opaque, and highly porous. Included are methods of fabricating the getter material (29) on the anode plate (10).

Abstract: A gated resonant tunneling diode has a semiconductor mesa formed on a semiconductor substrate, a tunneling barrier layer between the mesa and the substrate, and a gate layered over the substrate about the mesa and aligned in close proximity to the tunneling barrier layer. A control voltage on the gate laterally constricts a potential well in the tunneling barrier to control the electrical size of a channel within which tunnelling occurs across the tunneling barrier layer. Preferably the gate and the tunneling layer are disposed at the base of the mesa, and the gate makes a rectifying Schottky junction in connection with the tunneling barrier layer. The device is constructed using an anisotropic etch to form the mesa with an undercut wall and a top portion overhanging the undercut wall, and a nonconformal deposition of gate material to align the gate with the top portion of the mesa.