Abstract: A grounding arrangement (19) for a communication product (10) can include an external conductive surface (12), an internal ground (50), and a frequency selective ground path between the external conductive surface and the internal ground. The frequency selective ground path (54 and/or 56) provides for a high impedance path between the external conductive surface and the internal ground for signals at a predetermined operating frequency range for the communication product and a low inductance path between the external conductive surface and the ground for signals operating at electrostatic frequencies. The internal ground can reside on the surface of a printed circuit board (18) within the communication product and the external conductive surface can be coupled to the internal ground via a spring contact (20) and an inductor (54) or a resonant circuit (54 and 56).