Patents by Inventor Wilfred Ryan Vidamo Habana

Wilfred Ryan Vidamo Habana has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220337217
    Abstract: A packaged acoustic wave component includes a device substrate and an acoustic wave device mounted on the device substrate. A peripheral wall is attached to the device substrate and surrounds the acoustic wave device. A cap substrate is attached to the peripheral wall and spaced above the device substrate. The cap substrate has a marking layer disposed on a bottom surface of the cap substrate that is disposed above and faces the acoustic wave device. The marking layer is configured to receive one or more markings thereon.
    Type: Application
    Filed: April 6, 2022
    Publication date: October 20, 2022
    Inventors: Wilfred Ryan Vidamo Habana, Hidekazu Nakanishi, XiaoJun Chew, Mitsuhiro Furukawa
  • Publication number: 20220337213
    Abstract: A method for manufacturing a packaged acoustic wave component includes forming or providing a cap substrate, forming a metal layer on a surface of the cap substrate, marking the metal layer with one or more indicia and bonding the cap substrate to a device substrate that has an acoustic wave device on a surface thereof. The metal layer is paced from and faces the acoustic wave device.
    Type: Application
    Filed: April 6, 2022
    Publication date: October 20, 2022
    Inventors: Wilfred Ryan Vidamo Habana, Hidekazu Nakanishi, XiaoJun Chew, Mitsuhiro Furukawa