Abstract: Techniques for batch processing LGA and BGA packages for forming a very thin conformal metal film over the packages are described. An array of the packages is mounted on a carrier wafer coated with an adhesive layer. For BGA packages, there is a significant space between the bottom of the package body and the bottom of the balls, and this space must be blocked during the PVD process for forming the metal film. The techniques include ways to accommodate the thickness of the BGA while forming a seal around the perimeter of the package body during the metal deposition process. After the carrier wafer is removed from the PVD chamber, a pick and place vacuum nozzle pulls up on each package vertically. The force tears the thin metal film around the bottom edges of the package, resulting in a shielded package.