Abstract: In order to provide a spacer profile for an insulated glazing unit, which profile has a cross-section based on a rectangular shape, is provided with two parallel spaced side walls which, when said insulated glazing unit is assembled, will be placed against the panes of glass to be kept apart from each other, and is further provided with first and second transverse walls which extend between said side walls and of which the first will be adjacent to the edge of the glazing unit and the second will face the space between the panes, with the intention of enabling simple handling of said profile when assembling the spacer frame whilst maintaining a high absorptive capacity for water vapor, it is proposed that said spacer profile comprises a binder matrix and, embedded therein, a particulate adsorbent material for water vapor, and that the binder matrix is permeable to water vapor.

Abstract: A retaining ring to be fitted on a chemical mechanical polishing apparatus for semiconductor wafers is disclosed, the retaining ring comprising a carrier ring made of a first material and having fitting elements for fitting the carrier ring on the polishing apparatus; and a bearing ring comprising a plastic material, arranged concentrically on the carrier ring, the bearing ring resting with a first front side on a polishing surface of the polishing apparatus and being held on its side axially opposed to the first front side releasably, non-rotatably, with a positive and/or frictional connection and without adhesive on the carrier ring; wherein the first material has a higher rigidity than the plastic material of the bearing ring.

Abstract: In order to provide a spacer profile for an insulated glazing unit, which profile has a cross-section based on a rectangular shape, is provided with two parallel spaced side walls which, when said insulated glazing unit is assembled, will be placed against the panes of glass to be kept apart from each other, and is further provided with first and second transverse walls which extend between said side walls and of which the first will be adjacent to the edge of the glazing unit and the second will face the space between the panes, with the intention of enabling simple handling of said profile when assembling the spacer frame whilst maintaining a high absorptive capacity for water vapor, it is proposed that said spacer profile comprises a binder matrix and, embedded therein, a particulate adsorbent material for water vapor, and that the binder matrix is permeable to water vapor.

Abstract: In order to provide a spacer profile for an insulated glazing unit, which profile has a cross-section based on a rectangular shape, is provided with two parallel spaced side walls which, when said insulated glazing unit is assembled, will be placed against the panes of glass to be kept apart from each other, and is further provided with first and second transverse walls which extend between said side walls and of which the first will be adjacent to the edge of the glazing unit and the second will face the space between the panes, with the intention of enabling simple handling of said profile when assembling the spacer frame whilst maintaining a high absorptive capacity for water vapor, it is proposed that said spacer profile comprises a binder matrix and, embedded therein, a particulate adsorbent material for water vapor, and that the binder matrix is permeable to water vapor.

Abstract: In order to make a plastic material available for the production of tribologically stressed components, in particular, retaining rings for holding semiconductor wafers in chemical mechanical polishing devices, retaining rings produced therefrom, with which noticeably longer service lives of the retaining rings can be obtained, as well as a process for their production, it is disclosed that the plastic material comprises a plastic matrix and particulate TiC embedded therein.

Abstract: In order to provide a spacer profile for an insulated glazing unit, which profile has a cross-section based on a rectangular shape, is provided with two parallel spaced side walls which, when said insulated glazing unit is assembled, will be placed against the panes of glass to be kept apart from each other, and is further provided with first and second transverse walls which extend between said side walls and of which the first will be adjacent to the edge of the glazing unit and the second will face the space between the panes, with the intention of enabling simple handling of said profile when assembling the spacer frame whilst maintaining a high absorptive capacity for water vapor, it is proposed that said spacer profile comprises a binder matrix and, embedded therein, a particulate adsorbent material for water vapor, and that the binder matrix is permeable to water vapor.

Abstract: A retaining ring to be fitted on a chemical mechanical polishing apparatus for semiconductor wafers is disclosed, the retaining ring comprising a carrier ring made of a first material and having fitting elements for fitting the carrier ring on the polishing apparatus; and a bearing ring comprising a plastic material, arranged concentrically on the carrier ring, the bearing ring resting with a first front side on a polishing surface of the polishing apparatus and being held on its side axially opposed to the first front side releasably, non-rotatably, with a positive and/or frictional connection and without adhesive on the carrier ring; wherein the first material has a higher rigidity than the plastic material of the bearing ring.

Abstract: A retaining ring to be fitted on a chemical mechanical polishing apparatus for semiconductor wafers is disclosed, the retaining ring comprising a carrier ring made of a first material and having fitting elements for fitting the carrier ring on the polishing apparatus; and a bearing ring comprising a plastic material, arranged concentrically on the carrier ring, the bearing ring resting with a first front side on a polishing surface of the polishing apparatus and being held on its side axially opposed to the first front side releasably, non-rotatably, with a positive and/or frictional connection and without adhesive on the carrier ring; wherein the first material has a higher rigidity than the plastic material of the bearing ring.

Abstract: A retaining ring to be fitted on a chemical mechanical polishing apparatus for semiconductor wafers is disclosed, the retaining ring being of integral design made of a plastic material, wherein the retaining ring forms on a first front side thereof a bearing surface for supporting the retaining ring on a polishing surface of the polishing apparatus, and includes on the side thereof lying opposite the first front side thereof in axial direction fitting elements for fitting the retaining ring on the polishing apparatus.

Abstract: A retaining ring to be fitted on a chemical mechanical polishing apparatus for semiconductor wafers is disclosed, the retaining ring being of integral design made of a plastic material, wherein the retaining ring forms on a first front side thereof a bearing surface for supporting the retaining ring on a polishing surface of the polishing apparatus, and includes on the side thereof lying opposite the first front side thereof in axial direction fitting elements for fitting the retaining ring on the polishing apparatus.

Abstract: The invention presents a composite profile for use in the production of windows, doors, facade elements or the like, having inner and outer metallic profiles spaced at a specific distance from each other by a plastic profile. The invention further proposes that the plastic profile contain a surface of a solid, non-porous first plastics material, in a core region, a fine-pored cellular structure of a second plastics material. Additionally, the plastic profile may either be a solid, multilayer profile or a hollow profile. Such plastics profiles are particularly adapted to absorb tensile, bending and/or pressure loads.

Abstract: A retaining ring to be fitted on a chemical mechanical polishing apparatus for semiconductor wafers is disclosed, the retaining ring comprising a carrier ring made of a first material and having fitting elements for fitting the carrier ring on the polishing apparatus; and a bearing ring comprising a plastic material, arranged concentrically on the carrier ring, the bearing ring resting with a first front side on a polishing surface of the polishing apparatus and being held on its side axially opposed to the first front side releasably, non-rotatably, with a positive and/or frictional connection and without adhesive on the carrier ring; wherein the first material has a higher rigidity than the plastic material of the bearing ring.

Abstract: A retaining ring to be fitted on a chemical mechanical polishing apparatus for semiconductor wafers is disclosed, the retaining ring being of integral design made of a plastic material, wherein the retaining ring forms on a first front side thereof a bearing surface for supporting the retaining ring on a polishing surface of the polishing apparatus, and includes on the side thereof lying opposite the first front side thereof in axial direction fitting elements for fitting the retaining ring on the polishing apparatus.

Abstract: To achieve a spacer with adequate longitudinal stiffness and straightness, without this being accompanied by excessive heat transfer and inflated production costs, it is recommended that the ratio of the thickness of the legs to the thickness of the side walls is 0.8 or less and that the thermal resistance of the legs is higher than that in the side walls.

Abstract: In order to develop known solid or hollow plastics profiles, particularly those as used to absorb tensile, bending, and/or pressure loads, such as are primarily used as insulating segments in composite profiles containing metallic profiled elements, such that the problems normally encountered with the use of higher filler contents of the plastics material used, intended to favorably influence the expansion characteristics, are ressolved, the invention proposes that said profiles contain a surface layer of a solid, non-porous first plastics material and, in the core region, a fine-pored cellular structure of a second plastics material.

Abstract: In a process for extruding polymer melts (25) to form hollow chamber sections (21) by pressing the polymer melt through a shaping tool (24) with an internal shaping mandrel (26) and by subsequently sizing and cooling the hollow chamber section strand in a sizing and cooling unit (31) it is provided for the sizing and cooling of the hollow chamber section strand to be carried out in the sizing and cooling unit under extrusion pressure. A device for carrying out this process is characterized in that shaping tool (24) and sizing and cooling unit (31) are rigidly connected to form a closed system so that the strand extrusion pressure prevailing in the shaping tool can be propagated into the sizing and cooling unit, and that the shaping mandrel (26) protrudes out of the shaping tool (24) into the sizing and cooling unit (31).

Abstract: A composite section for frames of windows, doors, facade elements and the like consists of two metal section parts and at least one plastic insulating web which joins these metal section parts and is held with its ends in corresponding grooves of the metal section parts. The plastic material forming the insulating web is combined with a composite fiber skeleton consisting of heat-resistant fibers. The composite fiber skeleton is anchored in a positively and/or frictionally connected manner in the grooves of the metal section parts so as to also ensure cohesion of the metal section parts when the plastic material of the insulating web degenerates. The composite fiber skeleton is at least one band with thickened edge sections which are anchored in a positively connected manner in the grooves of the metal section parts.