Patents by Inventor Wilfried Houben

Wilfried Houben has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5302495
    Abstract: The present invention relates to a method for the photolithographic production of structures on a support, in particular, the production of structures of the ink feed channels for ink jet heads of ink jet printers, in which the support is provided with a dry-film resist. The object of the invention is to obtain a high steepness of the flank of the structures. This object is achieved in the manner that the support, together with the dry-film resist, is subjected to a brief exposure corresponding to the intended structuring, followed by a rapid heating of the support.
    Type: Grant
    Filed: October 21, 1991
    Date of Patent: April 12, 1994
    Assignee: Mannesmann Aktiengesellschaft
    Inventors: Rainer Wieland, Wilfried Houben
  • Patent number: 4357205
    Abstract: A method employing etching technique alone or in combination with galvanic production of electrically conducting or insulating ring zones in small diameter holes which extend through a workpiece having a small thickness employs the steps of applying a base metallization to the surface of the workpiece including the walls of the holes, filling the holes with a positive photoresist which upon drying withdraws from the hole openings toward the inside of the hole forming a plug therein, irradiating both sides of the workpiece with ultraviolet light for making the photoresist partially soluble for a lacquer developer, and dissolving the partially soluble photoresist away up to a selected lacquer ring thickness. These steps are then followed by one of two steps. For the production of insulating ring zones one or several metal films are applied by galvanic deposition to those regions which have been freed of photoresist and the residual photoresist is dissolved away and the base metallization is selectively etched.
    Type: Grant
    Filed: September 2, 1981
    Date of Patent: November 2, 1982
    Assignee: Siemens Aktiengesellschaft
    Inventors: Guenther Trausch, Wilfried Houben