Patents by Inventor Wilfried Lassmann

Wilfried Lassmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10728999
    Abstract: A printed circuit board (1) comprises a conductive outer layer (2) and at least one conductive inner layer (4, 14). At least one bus bar (7, 8) for conducting high current and at least one power semiconductor (12) for controlling and/or activating the high current are disposed on a side of the outer layer (2) facing away from the at least one inner layer (4, 14). The printed circuit board (1) allows for a high level of component density while simultaneously providing for effective heat dissipation. Furthermore, the printed circuit board (1) can be produced economically and flexibly.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: July 28, 2020
    Assignee: ZF FRIEDRICHSHAFEN AG
    Inventors: Wilfried Lassmann, Jörg Kühnl
  • Patent number: 10658925
    Abstract: A printed circuit board (1) for converting an input phase to at least one output phase (U,V,W), which has an input phase surface area with at least one conductive DC+ layer (28) and one conductive DC? layer (29) for each conductive DC+ layer (28), for conducting the input phase. There is at least one high-side power semiconductor (6) for each output phase (U, V, W) and one low-side power semiconductor (7) for each high-side power semiconductor (6), for switching the input phase. The at least one DC+ layer (28) corresponding to a respective DC? layer (29) is formed in a cover surface area (2), which covers at least 75% of the input phase surface area.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: May 19, 2020
    Assignee: ZF FRIEDRICHSHAFEN AG
    Inventors: Wilfried Lassmann, Jörg Kűhnl
  • Patent number: 10375824
    Abstract: A multifunctional high current circuit board includes a high current-carrying current-conducting layer and a switching layer, which is connected to at least one heat source, wherein high current-carrying potentials are conducted into the switching layer.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: August 6, 2019
    Assignee: ZF FRIEDRICHSHAFEN AG
    Inventors: Michael Sperber, Wilfried Lassmann, Dirk Schramm
  • Patent number: 10334718
    Abstract: A multi-functional high current circuit board comprises a current conduction layer having several strata for conduction of electric current, a switching layer comprising at least one power circuit breaker for switching an electric load, a control layer comprising at least one control element to control the at least one power circuit breaker, at least one shielding element for shielding the current conduction layer from the control layer and from the switching layer.
    Type: Grant
    Filed: October 21, 2014
    Date of Patent: June 25, 2019
    Assignee: ZF FRIEDRICHSHAFEN AG
    Inventors: Wilfried Lassmann, Michael Sperber
  • Publication number: 20190174619
    Abstract: A printed circuit board (1) comprises a conductive outer layer (2) and at least one conductive inner layer (4, 14). At least one bus bar (7, 8) for conducting high current and at least one power semiconductor (12) for controlling and/or activating the high current are disposed on a side of the outer layer (2) facing away from the at least one inner layer (4, 14). The printed circuit board (1) allows for a high level of component density while simultaneously providing for effective heat dissipation. Furthermore, the printed circuit board (1) can be produced economically and flexibly.
    Type: Application
    Filed: November 30, 2018
    Publication date: June 6, 2019
    Applicant: ZF Friedrichshafen AG
    Inventors: Wilfried Lassmann, Jörg Kühni
  • Publication number: 20190173377
    Abstract: A printed circuit board (1) for converting an input phase to at least one output phase (U,V,W), which has an input phase surface area with at least one conductive DC+ layer (28) and one conductive DC? layer (29) for each conductive DC+ layer (28), for conducting the input phase. There is at least one high-side power semiconductor (6) for each output phase (U, V, W) and one low-side power semiconductor (7) for each high-side power semiconductor (6), for switching the input phase. The at least one DC+ layer (28) corresponding to a respective DC? layer (29) is formed in a cover surface area (2), which covers at least 75% of the input phase surface area.
    Type: Application
    Filed: November 30, 2018
    Publication date: June 6, 2019
    Applicant: ZF Friedrichshafen AG
    Inventors: Wilfried LASSMANN, Jörg KÛHNL
  • Publication number: 20180263111
    Abstract: A multifunctional high current circuit board includes a high current-carrying current-conducting layer and a switching layer, which is connected to at least one heat source, wherein high current-carrying potentials are conducted into the switching layer.
    Type: Application
    Filed: August 11, 2016
    Publication date: September 13, 2018
    Applicant: ZF Friedrichshafen AG
    Inventors: Michael Sperber, Wilfried Lassmann, Dirk Schramm
  • Publication number: 20160286639
    Abstract: A multi-functional high current circuit board comprises a current conduction layer having several strata for conduction of electric current, a switching layer comprising at least one power circuit breaker for switching an electric load, a control layer comprising at least one control element to control the at least one power circuit breaker, at least one shielding element for shielding the current conduction layer from the control layer and from the switching layer.
    Type: Application
    Filed: October 21, 2014
    Publication date: September 29, 2016
    Applicant: ZF Friedrichshafen AG
    Inventors: Wilfried LASSMANN, Michael SPERBER
  • Publication number: 20160218599
    Abstract: A power control for an inductive machine comprises a printed circuit board having an electronic control element for controlling a current through the inductive machine, an electrical connection of the printed circuit board, a cooling element, connected in a thermally conductive manner to the control element, and a choke at the electrical connection for suppressing interference emissions. The choke is connected thereby to the cooling element in a thermally conductive manner.
    Type: Application
    Filed: January 25, 2016
    Publication date: July 28, 2016
    Applicant: ZF Friedrichshafen AG
    Inventors: Hans-Jürgen Hanft, Wilfried Lassmann
  • Patent number: 9265148
    Abstract: The invention proposes a printed circuit board with multiple layers, which features at least one outer layer and at least one inner layer adjacent to the outer layer. The printed circuit board features a plurality of micro-through-holes, which are formed between a supply voltage area of at least one outer layer and a supply voltage area of at least one inner layer.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: February 16, 2016
    Assignee: ZF FRIEDRICHSHAFEN AG
    Inventors: Wilfried Lassmann, Christian Büttner
  • Patent number: 9107295
    Abstract: A multilayer printed circuit board may comprise at least one printed circuit board front end that is thermally conductively metalized. An apparatus with such a printed circuit board is also proposed.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: August 11, 2015
    Assignee: ZF Friedrichshafen AG
    Inventors: Wilfried Lassmann, Christian Büttner
  • Publication number: 20140182898
    Abstract: The invention proposes a printed circuit board with multiple layers, which features at least one outer layer and at least one inner layer adjacent to the outer layer. The printed circuit board features a plurality of micro-through-holes, which are formed between a supply voltage area of at least one outer layer and a supply voltage area of at least one inner layer.
    Type: Application
    Filed: May 8, 2012
    Publication date: July 3, 2014
    Applicant: ZF Friedrichshafen AG
    Inventors: Wilfried Lassmann, Christian Büttner
  • Publication number: 20130146352
    Abstract: A multilayer printed circuit board may comprise at least one printed circuit board front end that is thermally conductively metalized. An apparatus with such a printed circuit board is also proposed.
    Type: Application
    Filed: December 10, 2012
    Publication date: June 13, 2013
    Inventors: Wilfried Lassmann, Christian Büttner