Patents by Inventor Wilfried Reschnar

Wilfried Reschnar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing a structural member from plates stacked on top of each other and soldered together
    Patent number: 6829824
    Abstract: A method for producing a component out of stacked plates (9, 10) soldered to one another, into at least some of which recesses (11, 12, 13) are made, is proposed, in which at least one solder layer (8) is provided between the plates (9, 10) for a solder diffusion process. According to the invention, the plates (9, 10), with solder layers (8) between them, are stacked on one another and compressed in the cold state before the solder diffusion process. With this provision, the use of complicated pressing tools in the actual solder diffusion process is avoided.
    Type: Grant
    Filed: May 8, 2003
    Date of Patent: December 14, 2004
    Assignee: Robert Bosch GmbH
    Inventors: Wilfried Reschnar, Stephan Borges, Stephan Leuthner, Juergen Hackenberg, Franz Wetzl
  • Method for producing a structural member from plates stacked on top of each other and soldered together
    Publication number: 20030173065
    Abstract: A method for producing a component out of stacked plates (9, 10) soldered to one another, into at least some of which recesses (11, 12, 13) are made, is proposed, in which at least one solder layer (8) is provided between the plates (9, 10) for a solder diffusion process. According to the invention, the plates (9, 10), with solder layers (8) between them, are stacked on one another and compressed in the cold state before the solder diffusion process. With this provision, the use of complicated pressing tools in the actual solder diffusion process is avoided.
    Type: Application
    Filed: May 8, 2003
    Publication date: September 18, 2003
    Inventors: Wilfried Reschnar, Stephan Borges, Stephan Leuthner, Juergen Hackenberg, Franz Wetzl
  • Diffusion-soldered joint and method for making diffusion-soldered joints
    Patent number: 6326088
    Abstract: A diffusion-soldered joint and a method for making diffusion-soldered joints includes a particularly actively diffusing, low-melting-point intermediate layer, applied in the molten state, introduced in the form of a solder carrier between at least two joint components. The solder carrier includes a metal foil that is equipped on both sides with solder layers, wherein the solder layers may include multiple layers.
    Type: Grant
    Filed: August 7, 1997
    Date of Patent: December 4, 2001
    Inventors: Rolf Mayer, Rolf Engelhart, Wilfried Reschnar, Godehard Schmitz
  • Method of and device for metering a solder material in a soldering device
    Patent number: 4932581
    Abstract: A method of and a device for metering a solder wire to a solder location in which an electric motor for driving solder wire feed means supported on a carriage of a solder wire metering device is actuated to provide for feeding a predetermined length of the solder wire to a soldering location, a magnitude of a mechanical feed force appliced to the solder wire is controlled in proportion to a magnitude of a contact pressure force acting on an end of the solder wire at the soldering location, and the electric motor is stopped after the predetermined length of the solder wire has been melted.
    Type: Grant
    Filed: April 4, 1989
    Date of Patent: June 12, 1990
    Assignee: Robert Bosch GmbH
    Inventors: Eckhard Ohle, Wilfried Reschnar