Patents by Inventor Wilfried Scherer

Wilfried Scherer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connection of a connection wire and a connection element
    Patent number: 11522302
    Abstract: A connection of a connection wire and a connection element are disclosed. In an embodiment a connection includes a connection wire having an insulation and a stud-shaped metallic connection element, wherein the connection wire is wound in a plurality of turns around the connection element, and wherein the turns include a first wire section, in which the connection wire is insulation-stripped, and a second wire section, in which the insulation is present.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: December 6, 2022
    Assignee: TDK ELECTRONICS AG
    Inventors: Wilfried Scherer, Herbert Lux, Balazs Nemeth
  • Connection of a Connection Wire and a Connection Element
    Publication number: 20200220276
    Abstract: A connection of a connection wire and a connection element are disclosed. In an embodiment a connection includes a connection wire having an insulation and a stud-shaped metallic connection element, wherein the connection wire is wound in a plurality of turns around the connection element, and wherein the turns include a first wire section, in which the connection wire is insulation-stripped, and a second wire section, in which the insulation is present.
    Type: Application
    Filed: August 3, 2018
    Publication date: July 9, 2020
    Inventors: Wilfried Scherer, Herbert Lux, Balazs Nemeth
  • Chip inductance
    Patent number: 6249208
    Abstract: A chip inductance is composed of a wound coil core (1) that is arranged erect on a system carrier (6). Perpendicularly residing clips (7) are located on the system carrier, whereby the coil core (1) is arranged within the space formed by the clips. The terminals are thereby located essentially outside the space existing between the end face planes of the coil core (1).
    Type: Grant
    Filed: August 18, 1999
    Date of Patent: June 19, 2001
    Assignee: Siemens Matsushita Components GmbH & Co. KG
    Inventors: Gerhard Proks, Elmar Walter, Hans-Dieter Eckardt, Manfred Espenhain, Jörg-Rudolf Maier, Kurt Marth, Wilfried Scherer
  • Method for bonding an insulated wire element on a contact
    Patent number: 4712723
    Abstract: A method for bonding a lacquer insulated wire to a metallic support is disclosed. The method is carried out in two steps: First, the wire is exposed to ultrasonic energy so that the lacquer is broken up and the wire is deformed in a certain area and welded to the support. Then the entire area of deformation is enclosed with a thixotropic adhesive. In preferred embodiments, the method is used for bonding the winding wire of a HF-inductor coil with contact elements shaped as wires or lugs.
    Type: Grant
    Filed: April 14, 1986
    Date of Patent: December 15, 1987
    Assignee: Siemens Aktiengesellschaft
    Inventors: Helmut Moll, Gerd Wiegel, Josef Schindler, Wilfried Scherer, Kurt Marth