Abstract: Automatic insertion and removal device for components, including a supply container for the components, a holding device for the components, an insertion head for taking the components from the supply container and inserting the components into the holding device, a removal head for removing the components from the holding device and for passing the components on, and a cam control connected to the heads for providing a motion cycle for the heads.

Abstract: Magnetic gate, including a magnet having a magnetic pole with an at least partly flat surface, a semiconductor chip having an integrated circuit, a mechanically permeable metal piece, and means attaching the semiconductor chip to the magnetically permeable metal piece for minimizing mechanical stresses acting on the chip to eliminate piezo effects and method of production thereof.

Abstract: Magnetic gate, including a magnet having a magnetic pole with an at least partly flat surface, a semiconductor chip having an integrated circuit, a mechanically permeable metal piece, and means attaching the semiconductor chip to the magnetically permeable metal piece for minimizing mechanical stresses acting on the chip to eliminate piezo effects and method of production thereof.

Abstract: Magnetic gate, including a magnet having two poles, one of the poles having an at least partly flat surfaces, a magnetically permeable metal piece bridging the magnetic flux of the magnet from one to the other of the poles, and a semiconductor chip having an integrated circuit, the semiconductor chip being piezoelectrically unsensitive and being applied to the permeable metal piece, and method of production thereof.

Abstract: Method of heat treating semiconductor wafers in a continuous operation wherein the wafers are initially introduced into a tube where they are subjected to a heat treatment and then removed from the tube. The wafers are transported through the tube by a pair of horizontally disposed rods on which they are carried and by an additional guide rod which is located above the horizontal plane of the first rods. All three rods have a groove in the form of a screw thread into which the wafers may be seated. All three rods are caused to rotate in the same direction and the frictional contact of the wafers with the walls of each groove causes the wafers to rotate in the opposite direction from the rods while at the same time causing them to advance through the tube while being heated.