Abstract: An arrangement for ascending and/or descending one or several persons along a high object, for example a high-tension line tower, a cable railway tower, high building etc., which arrangement is provided with a longitudinally extended rail profile and at least one guide component extending along the profile and a component for receiving a power transmission oriented towards the profile and/or the guide component. A lifting auxiliary is provided with at least one lifting support comprising at least one platform or a seat, a safety catch for persons and/or a handle, at least one force transmitting element connected or applied to the guide component and/or the profile and/or a drive and one organ carrying the element or the drive on or in at least the guide component and/or the profile.

Abstract: Computer-based design and verification tools provide integrated circuit layouts for use in chromeless phase lithography. A phase-mask design tool assigns feature size descriptors to circuit layout features, and mask features are configured using the feature size descriptors. Feature size descriptors can be assigned based on feature size ranges established based on a mask error function, feature dimensions with respect to a lithographic system resolution limit, or selected properties of aerial image intensity as a function of feature size. Circuit layout features are assigned mask features that include twin phase steps. In addition, circuit layout features associated with selected feature descriptors are assigned sub-resolution assist mask pattern portions or other mask pattern portions based on optical and process corrections.

Abstract: Computer-based design and verification tools provide integrated circuit layouts for use in chromeless phase lithography. A phase-mask design tool assigns feature size descriptors to circuit layout features, and mask features are configured using the feature size descriptors. Feature size descriptors can be assigned based on feature size ranges established based on a mask error function, feature dimensions with respect to a lithographic system resolution limit, or selected properties of aerial image intensity as a function of feature size. Circuit layout features are assigned mask features that include twin phase steps. In addition, circuit layout features associated with selected feature descriptors are assigned sub-resolution assist mask pattern portions or other mask pattern portions based on optical and process corrections.

Abstract: Disclosed are methods and apparatus for generating reference images to reduce the number of false defects found when comparing a reference image to a corresponding target image of a reticle or mask (or integrated circuit). In one specific implementation, parameters that characterize the reticle making process are collected from a representative reticle or reticle. These parameters are collected (e.g., measured) from a reticle prior to inspection of the reticle. The collected parameters are then used to simulate process effects on the reference images of the design data. After the layout data is altered to simulate process effects and represent a “real” layout after it has been fabricated into a mask, this “real” layout data is then altered again to simulate imaging effects. The resulting reference images now include both processing and imaging effects and may then be used during an inspection of a corresponding reticle or integrated circuit.

Abstract: A method is provided in which a pattern for a phase-shifting mask is firstly corrected in a first correction step. Subsequently, the pattern for the trimming mask is corrected with use of the corrected pattern for the phase-shifting mask in a second correction step. Mask data for the production of very-large-scale integrated circuits can be corrected in a simple manner by means of the two correction steps performed in succession.

Abstract: For lithographically producing the smallest structures at less than the exposure wavelengths in semiconductor fabrication, a double exposure is carried out using a thick phase mask and a trimming mask, the trimming mask further structures the phase-contrast lines produced by the phase mask. Besides transparent or opaque regions, the trimming mask also has phase-shifting regions. These surround transparent regions of the trimming mask through which the phase-contrast lines produced by the first mask are locally re-exposed, that is to say interrupted. The intensity profile of successive line sections is especially rich in contrast through the addition of the phase-shifting partially transparent regions on the second mask; the distances between the line sections can be reduced. The trimming mask, otherwise used only for larger structures, is therefore suitable for the configuration of the finest dimensionally critical structures.

Abstract: A method is provided in which a pattern for a phase-shifting mask is firstly corrected in a first correction step. Subsequently, the pattern for the trimming mask is corrected with use of the corrected pattern for the phase-shifting mask in a second correction step. Mask data for the production of very-large-scale integrated circuits can be corrected in a simple manner by means of the two correction steps performed in succession.

Abstract: The present invention phase shifting photomask is fabricated by means of a structured modification to the surface of a mask blank suitable for photolithography. Ion implantation, diffusion or similar processes are used to alter the optical properties of selected areas of a mask blank in such a way that these areas modify the intensity and phase of optical radiation transmitted through the processed areas of the mask blank substrate. The present invention provides the intended phase and intensity modulation by modification of a surface layer or other layer which is close to the surface of the mask blank. This leaves the actual surface of the mask blank intact and smooth without chemical changes to the surface of the mask blank. In this way optical radiation is not scattered on the borders of different materials and unwanted particulates will have a lower chance of adhering to a smooth surface with little or no topography.

Abstract: An apparatus and associated method for removing microscopic particle contaminants from an object such as a photomask or a semiconductor wafer. The apparatus utilizes an inspection device to identify the position of any particle contaminants on the target object. Once the positions of the various particle contaminants has been identified, a probe is dispatched to the position of one of the particle contaminants. The probe removes the particle contaminant from the target object and moves to a cleaning compartment, wherein the particle contaminant is removed from the probe. The probe is then moved to the next subsequent particle contaminant until all the contaminants are removed from the target object. By removing particle contaminants one-by-one from the target object, the manufacturing yield of zero defect products is greatly increased.

Abstract: An automatic toothbrush to optimally clean at least two sides of a tooth or a row of teeth comprising a cleaning head with a substantially U-shaped support to which are mounted clusters of bristles. The clusters of bristles are mounted on self-positioning pivoting levers of the U-shaped support in order to clean even little accessible tooth locations. Using at least one mechanical and/or electromagnetic drive means, control is made possible of a phase-shifted, impulsive motion of the support relative to the automatic toothbrush and of the pivoting levers with the cleaning bristles relative to the support to implement a cleaning or wiping action by the clusters of bristles from the gum to the tooth crown while, in the opposite direction, the motion takes place with at least reduced pressure applied to the teeth.

Abstract: A tooth cleaning device for optimal tooth cleaning comprises, on a U-shaped carrier (109), tufts of bristles (180), which are placed against the tooth using pressure bubbles (149) under equal cleaning pressure on both sides. With this arrangement the tufts of bristles (180) are fitted to individually self-positioning rocker arms (174, 178'), in order to also engage in the spaces between the teeth, which are difficult to access. With the aid of a further pressure bubble arrangement (147) using phase-shifted pulsating pressurization, with reference to the pressure-generating bubbles (149), a wiping movement of the tufts of bristles (180) with cleaning pressure is generated in the direction from the gum towards the crown of the tooth, in counter-direction without bearing pressure on the tooth.

Abstract: Soft-ice mixture, consisting of water or milk and commercially available powder, is frozen solid in a cylindrical container, then presented to a machine whereby the container is pressurized and which has an agitator that engages the surface of the solid to exert force along a narrow zone, whereby the material is locally melted. The momentarily melted material is immediately whipped by the agitator, before it refreezes. The agitator rotates at high speed (2,000 rpm) but advances into the material very slowly. For such action the agitator shaft is surrounded by an outer driver confined to rotation in one direction, with which the shaft has a splined connection, and the shaft in turn surrounds a threaded inner driver, with which the shaft has a threaded connection. For driving the agitator downward the inner driver is rotated in said direction, but slower than the outer driver; for driving it upward the inner driver is also rotated in said direction, but faster than the outer driver.

Abstract: A household soft-ice-cream machine is disclosed. The soft-ice-cream machine includes a housing with a removable lid, said housing including a hollow chamber in which soft ice cream may be formed. An agitator for agitating a soft ice cream mix is located in the hollow chamber. A replaceable cooling cartridge is located in the housing below the hollow compartment and cools the compartment. A replaceable pressure gas cartridge is attached to the housing and introduces pressurized gas into the hollow chamber. A soft ice cream removal valve permits removal of the soft ice cream from the hollow compartment.

Abstract: A ceramic material for electronic circuit devices is sintered at less than r equal to 1000.degree. C. temperature. A filler material such as quartz and a glassy binder RO-Al.sub.2 O.sub.3 -B.sub.2 O.sub.3 are mixed together along with an appropriate glassy binder prior to firing. RO is drawn from the group of metal oxides MgO, CaO, SrO, BaO, ZnO or CdO and the glassy binders form no more than 40 vol % of the ceramic material. The glassy binder has a suitable viscosity and other properties so that after it is mixed with the quartz filler, sintering occurs at the relatively low temperature. As a consequence, high conductivity conductors made of copper, silver and gold can be appropriately metallized prior to firing. The strength and low dielectric constant of the ceramic material make the material well adapted for ceramic substrates, thick films and the like which are used in VHSIC and VLSI applications.