Patents by Inventor Wilhelm Prinz von Hessen

Wilhelm Prinz von Hessen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8803059
    Abstract: A sensor and a corresponding method for the determination of the incidence angle of a radiation source are provided. The sensor has a diode assembly of avalanche photodiodes in a semiconductor layer and an application specific integrated circuit, a distance layer, an aperture structure located on the distance layer, and contacts for electrically connecting the sensor. The layers and structures are positioned directly on top of each other and match in their shape, size or thickness.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: August 12, 2014
    Assignee: Silicon Micro Sensors GmbH
    Inventors: Erik Busse, Wilhelm Prinz von Hessen
  • Patent number: 8433445
    Abstract: A method and device to control electrical devices using motion detection are presented, through which an object inside a monitoring area which is subdivided into a pre-detection area and a detection area is successively identified as well as verified in the detection area for reducing power input in standby mode and during operation in the main cycle using distance measurements and its position consequently determined. During the course of the distance measurements, the control device is brought into a readiness state and later on into operating state. After finishing the distance measurements and determining the position of the object in the detection area, an output signal which serves to control an external electrical device is generated by a control device.
    Type: Grant
    Filed: October 25, 2010
    Date of Patent: April 30, 2013
    Assignee: Silicon Micro Sensors GmbH
    Inventors: Erik Busse, Wilhelm Prinz Von Hessen
  • Publication number: 20120160992
    Abstract: A sensor and a corresponding method for the determination of the incidence angle of a radiation source are provided. The sensor has a diode assembly of avalanche photodiodes in a semiconductor layer and an application specific integrated circuit, a distance layer, an aperture structure located on the distance layer, and contacts for electrically connecting the sensor. The layers and structures are positioned directly on top of each other and match in their shape, size or thickness.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 28, 2012
    Applicant: SILICON MICRO SENSORS GMBH
    Inventors: Erik BUSSE, Wilhelm Prinz von HESSEN
  • Patent number: 7954384
    Abstract: A pressure sensor comprises a housing, a housing plug and a pressure port, which projects into the housing. The pressure sensor has a pressure-sensing element adhesively cemented on the pressure port, so that a passage, located in the pressure port, is sealed. To produce an adhesive film between the pressure port and the housing, the pressure port or the housing or both exhibit a recess in a region, which borders at least section by section on the adhesive film. The volume of recess is equal to the volume of the adhesive film. To produce the adhesive film, the intermediate space between the pressure port and the housing is filled with the adhesive, which was introduced into the recess, while utilizing a capillary effect.
    Type: Grant
    Filed: September 3, 2009
    Date of Patent: June 7, 2011
    Assignee: Silicon Micro Sensors GmbH
    Inventors: Jens Koehler, Wilhelm Prinz Von Hessen
  • Publication number: 20110098868
    Abstract: A method and device to control electrical devices using motion detection are presented, through which an object inside a monitoring area which is subdivided into a pre-detection area and a detection area is successively identified as well as verified in the detection area for reducing power input in standby mode and during operation in the main cycle using distance measurements and its position consequently determined. During the course of the distance measurements, the control device is brought into a readiness state and later on into operating state. After finishing the distance measurements and determining the position of the object in the detection area, an output signal which serves to control an external electrical device is generated by a control device.
    Type: Application
    Filed: October 25, 2010
    Publication date: April 28, 2011
    Applicant: SILICON MICRO SENSORS GMBH
    Inventors: Erik BUSSE, Wilhelm PRINZ VON HESSEN
  • Publication number: 20110080495
    Abstract: A method and camera system are provided in which source images of a high resolution generated by an image sensor are processed by a processor in a way that, following a down-scaling of the resolution of the source image, an image copy is generated which can be transmitted to and processed in an external control unit. Additionally, a cropped image of a higher resolution in comparison to the image copy is created from the source image and also transmitted to the external control unit.
    Type: Application
    Filed: October 1, 2010
    Publication date: April 7, 2011
    Applicant: SILICON MICRO SENSORS GMBH
    Inventors: Erik BUSSE, Wilhelm PRINZ VON HESSEN
  • Publication number: 20100089169
    Abstract: A pressure sensor comprises a housing, a housing plug and a pressure port, which projects into the housing. The pressure sensor has a pressure-sensing element adhesively cemented on the pressure port, so that a passage, located in the pressure port, is sealed. To produce an adhesive film between the pressure port and the housing, the pressure port or the housing or both exhibit a recess in a region, which borders at least section by section on the adhesive film. The volume of recess is equal to the volume of the adhesive film. To produce the adhesive film, the intermediate space between the pressure port and the housing is filled with the adhesive, which was introduced into the recess, while utilizing a capillary effect.
    Type: Application
    Filed: September 3, 2009
    Publication date: April 15, 2010
    Applicant: SILICON MICRO SENSORS GMBH
    Inventors: Jens KOEHLER, Wilhelm Prinz Von Hessen
  • Patent number: 6518665
    Abstract: A flip chip having a chip passivation layer disposed on a metalization layer. Terminal vias are formed in the passivation layer exposing a portion of the metalization layer and terminal metalization is disposed on the metalization layer at the terminal vias. A stress reducing layer is disposed on the chip passivation layer with underfill apertures formed in the stress reducing layer so as to expose selected portions of the chip passivation layer, thereby enhancing the adhesion of an underfill material to the flip chip.
    Type: Grant
    Filed: September 16, 1999
    Date of Patent: February 11, 2003
    Assignee: Delaware Capital Formation, Inc.
    Inventors: George Russell Westby, Peter Borgesen, Wilhelm Prinz von Hessen