Abstract: A method is disclosed for making an insulated splice or terminal, the method including the steps of adhering an elongated layer of non-conductive material to an elongated layer of electrically conductive material so as to form a composite supply strip; severing a predetermined length of said supply strip from the remaining supply of said strip; and crimping said length about the elements to be joined until said electrically conductive material is in electrical contact with the said elements and so that the non-conductive material forms an outer insulated layer enclosing said splice or at least a portion of said terminal. In a preferred method of the instant invention, a further step of causing the non-conductive material of the splice to "flow" is employed whereby a resultant sealed splice is produced which is impervious to moisture and other contaminants.