Patents by Inventor Wilhelm Schmid

Wilhelm Schmid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080111578
    Abstract: According to the invention, one or more external test connection contact points (pads; pins; balls), are provided in an integrated circuit component (chip) (1), through which signals (4, 5, 6) that are to be measured or analyzed are selectively fed, e.g. by means of a multiplex circuit (7,8), and wherein the signals may be connected by means of routes located internally in the component from switch points that are not directly accessible, e.g. points inside the chip (15 to 20) or covered contact points. The device according to the invention is particularly useful for highly integrated semiconductor chips.
    Type: Application
    Filed: January 22, 2008
    Publication date: May 15, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Wilhelm Schmid, Carsten Dorrhofer
  • Patent number: 7342404
    Abstract: According to the invention, one or more external test connection contact points (pads; pins; balls), are provided in an integrated circuit component (chip) (1), through which signals (4, 5, 6) that are to be measured or analyzed are selectively fed, e.g. by means of a multiplex circuit (7,8), and wherein the signals may be connected by means of routes located internally in the component from switch points that are not directly accessible, e.g. points inside the chip (15 to 20) or covered contact points. The device according to the invention is particularly useful for highly integrated semiconductor chips.
    Type: Grant
    Filed: April 4, 2006
    Date of Patent: March 11, 2008
    Assignee: Infineon Technologies AG
    Inventors: Wilhelm Schmid, Carsten Dörrhöfer
  • Patent number: 7239162
    Abstract: According to the invention, one or more external test connection contact points (pads; pins; balls), are provided in an integrated circuit component (chip) (1), through which signals (4, 5, 6) that are to be measured or analyzed are selectively fed, e.g. by means of a multiplex circuit (7,8), and wherein the signals may be connected by means of routes located internally in the component from switch points that are not directly accessible, e.g. points inside the chip (15 to 20) or covered contact points. The device according to the invention is particularly useful for highly integrated semiconductor chips.
    Type: Grant
    Filed: January 4, 2005
    Date of Patent: July 3, 2007
    Assignee: Infineon Technologies AG
    Inventors: Wilhelm Schmid, Carsten Dörrhöfer
  • Publication number: 20060176066
    Abstract: According to the invention, one or more external test connection contact points (pads; pins; balls), are provided in an integrated circuit component (chip) (1), through which signals (4, 5, 6) that are to be measured or analyzed are selectively fed, e.g. by means of a multiplex circuit (7,8), and wherein the signals may be connected by means of routes located internally in the component from switch points that are not directly accessible, e.g. points inside the chip (15 to 20) or covered contact points. The device according to the invention is particularly useful for highly integrated semiconductor chips.
    Type: Application
    Filed: April 4, 2006
    Publication date: August 10, 2006
    Inventors: Wilhelm Schmid, Carsten Dorrhofer
  • Patent number: 6949940
    Abstract: According to the invention, one or more external test connection contact points (pads; pins; balls), are provided in an integrated circuit component (chip) (1), through which signals (4, 5, 6) that are to be measured or analyzed are selectively fed, e.g. by means of a multiplex circuit (7, 8), and wherein the signals may be connected by means of routes located internally in the component from switch points that are not directly accessible, e.g. points inside the chip (15 to 20) or covered contact points. The device according to the invention is particularly useful for highly integrated semiconductor chips.
    Type: Grant
    Filed: December 18, 2000
    Date of Patent: September 27, 2005
    Assignee: Infineon Technologies AG
    Inventors: Wilhelm Schmid, Carsten Dörrhöfer
  • Publication number: 20050116732
    Abstract: According to the invention, one or more external test connection contact points (pads; pins; balls), are provided in an integrated circuit component (chip) (1), through which signals (4, 5, 6) that are to be measured or analyzed are selectively fed, e.g. by means of a multiplex circuit (7,8), and wherein the signals may be connected by means of routes located internally in the component from switch points that are not directly accessible, e.g. points inside the chip (15 to 20) or covered contact points. The device according to the invention is particularly useful for highly integrated semiconductor chips.
    Type: Application
    Filed: January 4, 2005
    Publication date: June 2, 2005
    Inventors: Wilhelm Schmid, Carsten Dorrhofer
  • Publication number: 20050093562
    Abstract: According to the invention, one or more external test connection contact points (pads; pins; balls), are provided in an integrated circuit component (chip) (1), through which signals (4, 5, 6) that are to be measured or analyzed are selectively fed, e.g. by means of a multiplex circuit (7,8), and wherein the signals may be connected by means of routes located internally in the component from switch points that are not directly accessible, e.g. points inside the chip (15 to 20) or covered contact points. The device according to the invention is particularly useful for highly integrated semiconductor chips.
    Type: Application
    Filed: November 30, 2004
    Publication date: May 5, 2005
    Inventors: Wilhelm Schmid, Carsten Dorrhofer
  • Patent number: 6346836
    Abstract: A synchronizing stage for synchronizing asynchronous signals provides for a signal stage to be connected in parallel with a clocked input stage and a holding stage that is clocked in anti-phase. The signal stage is clocked in anti-phase with the input stage. An output stage is connected downstream of the parallel circuit. The synchronizing stage reduces the probability of a metastable state in the event of overlapping and non-overlapping clock signals and ensures the reliable transfer of an input datum to the output of the synchronizing stage.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: February 12, 2002
    Assignee: Infineon Technologies
    Inventors: Dirk Wieberneit, Wilhelm Schmid
  • Publication number: 20010052783
    Abstract: According to the invention, one or more external test connection contact points (pads; pins; balls), are provided in an integrated circuit component (chip) (1), through which signals (4, 5, 6) that are to be measured or analyzed are selectively fed, e.g. by means of a multiplex circuit (7, 8), and wherein the signals may be connected by means of routes located internally in the component from switch points that are not directly accessible, e.g. points inside the chip (15 to 20) or covered contact points. The device according to the invention is particularly useful for highly integrated semiconductor chips.
    Type: Application
    Filed: December 18, 2000
    Publication date: December 20, 2001
    Inventors: Wilhelm Schmid, Carsten Dorrhofer