Abstract: A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore extends into the layer stack and has a first bore section with a first diameter (D1) and a connected second bore section with a second diameter (D2) differing from the first diameter (D1). A thermally conductive material fills substantially the entire bore. The bore is in particular formed by laser drilling.

Abstract: There is provided a component carrier comprising: (a) a stack of at least one electrically conductive layer structure and at least one electrically insulating layer structure; and (b) a bypass capacitance structure formed on an/or within the stack. The bypass capacitance structure comprises an electrically conductive film structure having a rough surface, a dielectric film structure formed on the rough surface, and a further electrically conductive film structure formed on the dielectric film structure.

Abstract: A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure with a bore extending into the layer stack. The bore includes a first bore section with a first diameter and a connected second bore section with a second diameter differing from the first diameter. The component carrier further comprises a thermally conductive material filling substantially the entire bore. The bore is in particular formed by mechanical drilling.

Abstract: A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore extends into the layer stack and has a first bore section with a first diameter (D1) and a connected second bore section with a second diameter (D2) differing from the first diameter (D1). A thermally conductive material fills substantially the entire bore. The bore is in particular formed by laser drilling.

Abstract: A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore extends into the layer stack and has a first bore section with a first diameter (D1) and a connected second bore section with a second diameter (D2) differing from the first diameter (D1). A thermally conductive material fills substantially the entire bore. The bore is in particular formed by laser drilling.

Abstract: There is provided a component carrier comprising: (a) a stack of at least one electrically conductive layer structure and at least one electrically insulating layer structure; and (b) a bypass capacitance structure formed on an/or within the stack. The bypass capacitance structure comprises an electrically conductive film structure having a rough surface, a dielectric film structure formed on the rough surface, and a further electrically conductive film structure formed on the dielectric film structure.

Abstract: A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure with a bore extending into the layer stack. The bore includes a first bore section with a first diameter and a connected second bore section with a second diameter differing from the first diameter. The component carrier further comprises a thermally conductive material filling substantially the entire bore. The bore is in particular formed by mechanical drilling.

Abstract: A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore extends into the layer stack and has a first bore section with a first diameter (D1) and a connected second bore section with a second diameter (D2) differing from the first diameter (D1). A thermally conductive material fills substantially the entire bore. The bore is in particular formed by laser drilling.

Abstract: A technique for making an RFID tag that includes creating recesses or trenches in an insulated substrate. Conductive traces are created in the trenches so as to create an inductor coil for the RFID tag.

Abstract: A technique for making an RFID tag that includes creating recesses or trenches in an insulated substrate. Conductive traces are created in the trenches so as to create an inductor coil for the RFID tag.

Abstract: An adapter arrangement for electrically testing printed circuit boards consists of two probe adapters with a uniform grid separation of the probes and two translator foils on whose sides facing the probe adapters there are contact areas with the pitch of the probe adapter. On the sides facing the printed circuit board, the arrangement of the contact areas and the contact points located thereon is the same as the grid on the printed circuit board under test. Between the translator foils a vacuum is generated with the help of rubber seals, a through hole, a valve and a suction hose. This vacuum creates a rigid package which permits good contact with the probes on both sides. The inserted support layers, which can be conventional printed circuit boards, prevent the translator foils from buckling. The various types of extremely complex printed circuit board can be electrically tested rapidly and cheaply using this arrangement.

Abstract: A method for the production of printed circuit boards comprises the steps of producing recesses (2, 3, 4, 5) and/or through holes (2a) in a substrate (1) made from insulating material, in particular by means of laser-ablation, wherein the recesses and/or through holes correspond to the desired structure of conductive tracks and/or plated through holes; introducing a base layer (6) on one or both sides of the substrate (1); and introducing a conductive material (7) onto the base layer (6) which is catalytic and/or activating relative to the conductive material (7). The base layer (6) is selectively removed from the substrate (1), except in the recesses and/or in the through holes, by means of laser-ablation prior to introduction of the conductive material (7). Processing of the surface of the conductive material, the base layer or of the substrate is no longer necessary.

Abstract: An apparatus for laser machining by creating a plurality of discrete and separate beams which are sent to a deflecting device including a support and a plurality of individual elements that act independently and are individually controlled to machine different points on the workpiece simultaneously.

Abstract: A printed circuit board is made by producing recesses and/or holes in an electric insulating substrate by laser ablation. The recesses correspond to a desired pattern of conductor structures and/or holes. Conductive material is then deposited on substantially an entire face of the substrate. Conductive material is then removed from the substrate outside the desired pattern of conductor structures and/or holes.