Patents by Inventor Wilhelmus Gijsbertus Leonardus van Sprang

Wilhelmus Gijsbertus Leonardus van Sprang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPONENT PLACEMENT SYSTEMS AND METHODS OF OPERATING THE SAME
    Publication number: 20230189493
    Abstract: A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.
    Type: Application
    Filed: February 9, 2023
    Publication date: June 15, 2023
    Inventors: Roy Brewel, Rudolphus Hendrikus Hoefs, Wilhelmus Gijsbertus Leonardus Van Sprang
  • Component placement systems and methods of operating the same
    Patent number: 11612089
    Abstract: A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: March 21, 2023
    Assignee: Assembleon B.V.
    Inventors: Roy Brewel, Rudolphus Hendrikus Hoefs, Wilhelmus Gijsbertus Leonardus Van Sprang
  • COMPONENT PLACEMENT SYSTEMS AND METHODS OF OPERATING THE SAME
    Publication number: 20220183198
    Abstract: A component placement system is provided. The component placement system includes: a first bond head array configured for simultaneously carrying a first plurality of electronic components; a second bond head array configured for simultaneously carrying a second plurality of electronic components; a first motion system for simultaneously carrying the first bond head array and the second bond head array along a first motion axis; and a second motion system for carrying the first bond head array independent of the second bond head array.
    Type: Application
    Filed: December 3, 2021
    Publication date: June 9, 2022
    Inventors: Roy Brewel, Rudolphus Hendrikus Hoefs, Wilhelmus Gijsbertus Leonardus Van Sprang
  • Method for selectively electroplating apertured metal or metallized products
    Patent number: 5702583
    Abstract: The invention relates to a method and an apparatus for selectively electroplating apertured products. The products are masked in accordance with the intended plating and subsequently exposed to an electrolyte in order to electroplate the products. For masking purposes a fully closed photoresist layer is electrophoretically applied to the products, and after drying of the photoresist layer, the products are covered with a photomask in accordance with the locations to be plated, after which exposure takes place. Then the photoresist layer is partially removed, while the remaining part of the photoresist layer remains behind on the products, to serve as a mask for the metal products upon electroplating.
    Type: Grant
    Filed: September 25, 1995
    Date of Patent: December 30, 1997
    Assignee: Meco Equipment Engineers B.V.
    Inventors: Jorg Werner Rischke, Wilhelmus Gijsbertus Leonardus van Sprang