Patents by Inventor Wilhelmus Hubertus Maria van den Bogaard

Wilhelmus Hubertus Maria van den Bogaard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Rogowski coil
    Patent number: 10877073
    Abstract: A Rogowski coil includes: a multilayer printed circuit board having a plurality of layers forming at least an outer top circuit board surface, an outer bottom circuit board surface, an inner top circuit board surface, and an inner bottom circuit board surface; a first winding formed by a plurality of tracks arranged alternately on the outer top circuit board surface and the outer bottom circuit board surface, the plurality of tracks being electrically connected by vias extending from the outer top circuit board surface to the outer bottom circuit board surface; and a second, return winding enveloped by the first winding. The multilayer printed circuit board includes a central passage opening for passage of a current conducting conductor. Axes of the first and second winding are arranged concentric around the central passage opening. The first and second winding are electrically arranged in series.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: December 29, 2020
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Gerard Cornelis Schoonenberg, Elisabeth Johanna Maria Morskieft, Wilhelmus Hubertus Maria van den Bogaard
  • ROGOWSKI COIL
    Publication number: 20190187185
    Abstract: A Rogowski coil includes: a multilayer printed circuit board having a plurality of layers forming at least an outer top circuit board surface, an outer bottom circuit board surface, an inner top circuit board surface, and an inner bottom circuit board surface; a first winding formed by a plurality of tracks arranged alternately on the outer top circuit board surface and the outer bottom circuit board surface, the plurality of tracks being electrically connected by vias extending from the outer top circuit board surface to the outer bottom circuit board surface; and a second, return winding enveloped by the first winding. The multilayer printed circuit board includes a central passage opening for passage of a current conducting conductor. Axes of the first and second winding are arranged concentric around the central passage opening. The first and second winding are electrically arranged in series.
    Type: Application
    Filed: December 18, 2018
    Publication date: June 20, 2019
    Inventors: Gerard Cornelis SCHOONENBERG, Elisabeth Johanna Maria MORSKIEFT, Wilhelmus Hubertus Maria van den Bogaard