Abstract: Non-fibrous-reinforced thermoplastic molding compositions comprising a metal powder as a heat stabilizer are provided. The metal powder has a weight average particle size (dm) of at most 1 mm and the metal in the metal powder is selected from the group consisting of elementary metals from Group VB, VIB, VIIB and VIIIB of the Periodic Table, and mixtures thereof. A thermoplastic polyamide is also provided with an Mw of at most 50,000 g/mol, or a blend of at least two thermoplastic polymers with Tmelt or Tg differing by at least 20° C., or a second thermostabilizer. The invention also relates to the use of these compositions in high temperature applications.

Abstract: A thermostabilized thermoplastic molding composition includes a) a thermoplastic polyamide composition which consists of a blend of at least two polyamides. The at least two polyamides include a1) at least 50 mass %, relative to the total mass of the thermoplastic polyamide composition, of a first polyamide (PA-1) selected from the group consisting of polyamide-4,6, polyamide-6,6 and semi-aromatic polyamides and mixtures thereof; and a2) an amount of 1-50 mass %, relative to the total mass of the thermoplastic polyamide composition, of a second polyamide (PA-2) selected from the group consisting of polyamide-6 and copolymers thereof. The composition also contains b) 0.001-3 mass %, relative to the total mass of the thermoplastic polyamide composition, of a copper salt; and c) 0.01-10 mass %, relative to the total mass of the thermoplastic polyamide composition, of iron oxide. The molding composition exhibits reduced deterioration when exposed to an elevated temperature of 230° C.

Abstract: Non-fibrous-reinforced thermoplastic moulding compositions comprising a metal powder as a heat stabilizer are provided. The metal powder has a weight average particle size (dm) of at most 1 mm and the metal in the metal powder is selected from the group consisting of elementary metals from Group VB, VIIB, VIIB and VIIIB of the Periodic Table, and mixtures thereof. A thermoplastic polyamide is also provided with an Mw of at most 50,000 g/mol, or a blend of at least two thermoplastic polymers with Tmelt or Tg differing by at least 20° C., or a second thermostabilizer. The invention also relates to the use of these compositions in high temperature applications.

Abstract: A thermostabilized thermoplastic moulding composition includes a) a thermoplastic polyamide composition which consists of a blend of at least two polyamides. The at least two polyamides include a1) at least 50 mass %, relative to the total mass of the thermoplastic polyamide composition, of a first polyamide (PA-1) selected from the group consisting of polyamide-4,6, polyamide-6,6 and semi-aromatic polyamides and mixtures thereof; and a2) an amount of 1-50 mass %, relative to the total mass of the thermoplastic polyamide composition, of a second polyamide (PA-2) selected from the group consisting of polyamide-6 and copolymers thereof. The composition also contains b) 0.001-3 mass %, relative to the total mass of the thermoplastic polyamide composition, of a copper salt; and c) 0.01-10 mass %, relative to the total mass of the thermoplastic polyamide composition, of iron oxide. The moulding composition exhibits reduced deterioration when exposed to an elevated temperature of 230° C.

Abstract: The invention relates to a thermostabilized thermoplastic molding composition comprising (a) a thermoplastic polyamide composition, consisting of a blend of at least two polyamides comprising (a.1) at least 50% mass, relative to the total mass of the thermoplastic polyamide composition, of a first polyamide (PA-1), being a semi-crystalline polyamide having a melting point Tm-1, or being an amorphous polyamide having a glass transition point Tg-1, wherein Tm-1 and Tg-1 together are denoted as T-1 and T-1 is at least 200° C. and (a.2) a second polyamide (PA-2), with a C/N ratio of at most 7, being a semi-crystalline polyamide having a melting point Tm-2 or an amorphous polyamide having a glass transition point Tg-2, wherein Tm-2 and Tg-2 together are denoted as T-2 and T-2 is at least 20° C.

Abstract: Non-fibrous-reinforced thermoplastic moulding compositions comprising a metal powder as a heat stabilizer are provided. The metal powder has a weight average particle size (dm) of at most 1 mm and the metal in the metal powder is selected from the group consisting of elementary metals from Group VB, VIB, VIIB and VIIIB of the Periodic Table, and mixtures thereof. A thermoplastic polyamide is also provided with an Mw of at most 50,000 g/mol, or a blend of at least two thermoplastic polymers with Tmelt or Tg differing by at least 20° C., or a second thermostabilizer. The invention also relates to the use of these compositions in high temperature applications.

Abstract: Process for preparing a moulding composition comprising melt-mixing of a thermoplastic polymer, a non-metallic inorganic filler and elementary iron having a weight average particle size of at most 450 ?m to form a composition wherein the thermoplastic polymer forms a continuous phase. The invention further relates to a composition obtainable with the inventive process, the use thereof for making moulded parts, as well as to moulded parts and the use thereof in applications wherein the moulded part is exposed to elevated temperature.

Abstract: The invention relates to a thermostabilized thermoplastic moulding composition comprising (a) a thermoplastic polyamide composition, consisting of a blend of at least two polyamides comprising (a.1) at least 50% mass, relative to the total mass of the thermoplastic polyamide composition, of a first polyamide (PA-1), being a semi-crystalline polyamide having a melting point Tm-1, or being an amorphous polyamide having a glass transition point Tg-1, wherein Tm-1 and Tg-1 together are denoted as T-1 and T-1 is at least 200° C. and (a.2) a second polyamide (PA-2), with a C/N ratio of at most 7, being a semi-crystalline polyamide having a melting point Tm-2 or an amorphous polyamide having a glass transition point Tg-2, wherein Tm-2 and Tg-2 together are denoted as T-2 and T-2 is at least 20° C.

Abstract: The invention relates to non-fibrous-reinforced thermoplastic moulding compositions comprising a metal powder as a heat stabilizer wherein the metal powder has a weight average particle size (dm) of at most 1 mm and the metal in the metal powder is selected from the group consisting of elementary metals from Group VB, VIIB, VIIB and VIIIB of the Periodic Table, and mixtures thereof, and next to the said metal powders a thermoplastic polyamide with an Mw of at most 50.000 g/mol, or a blend of at least two thermoplastic polymers with Tmelt or Tg differing by at least 20° C., or a second thermostabilizer.

Abstract: The invention relates to a polyamide composition for the production of electrical and electronic components that are suitable for the conditions of the surface mounting technology. In particular, the composition exhibits a high resistance to blistering during the reflow soldering process. The composition according to the invention comprises (a) a polyamide having a melting point higher than 280° C., (b) a polymer having a melting point lower than 230° C., (c) a halogen-containing compound, (d) optionally a synergist for the flame-retardant properties (e) reinforcing material (f) optionally other additives. A particularly good resistance to blistering is achieved if (f) contains at least a compound with acid imide groups.