Abstract: A method and apparatus for measurement of a characteristic of a substrate. A target is present on the substrate and a measurement is performed during a scanning movement of the substrate. The scanning movement of the substrate is a linear movement and the measurement includes obtaining a reflected image of the target using a pulsed light source, the duration of a single light pulse being less than 100 psec. A lithographic apparatus includes such a measurement apparatus, and a device manufacturing method includes such a measurement method.

Abstract: Disclosed is a method of determining higher order distortions of a patterning device of a lithographic apparatus, and associated apparatus. The higher order distortions are measured using the transmission imaging device. In a main embodiment, enhanced reticles are used which may have additional alignment gratings in the perimeter, in the scribe lanes of the image field or in the image field itself.

Abstract: Disclosed is a method of determining higher order distortions of a patterning device of a lithographic apparatus, and associated apparatus. The higher order distortions are measured using the transmission imaging device. In a main embodiment, enhanced reticles are used which may have additional alignment gratings in the perimeter, in the scribe lanes of the image field or in the image field itself.

Abstract: The illumination profile of a radiation beam is initially measured using a CCD detector. A reference mirror is then placed in the focal plane of the high aperture lens and the reflected radiation measured. By comparing the illumination profile and the detected radiation it is possible to determine the transmission losses for S and P polarisation which can then be used in scatterometry modeling.

Abstract: A method and apparatus for measurement of a characteristic of a substrate. A target is present on the substrate and a measurement is performed during a scanning movement of the substrate. The scanning movement of the substrate is a linear movement and the measurement includes obtaining a reflected image of the target using a pulsed light source, the duration of a single light pulse being less than 100 psec. A lithographic apparatus includes such a measurement apparatus, and a device manufacturing method includes such a measurement method.

Abstract: A sensor measuring properties of a substrate in which radiation is projected onto the substrate by a radiation projector that has a first part configured such that the radiation projection can project onto the substrate linearly polarized radiation oriented in a first direction and a second part configured such that the radiation projector can project onto the substrate linearly polarized radiation oriented in a second direction orthogonal to the first direction.

Abstract: A metrology apparatus for measuring a parameter of a microscopic structure on a substrate, the apparatus comprising a supercontinuum light source arranged to generate a measurement beam, an optical system arranged to direct the measurement beam onto the substrate and a sensor for detecting radiation reflected and/or diffracted by the structure.

Abstract: The illumination profile of a radiation beam is initially measured using a CCD detector. A reference mirror is then placed in the focal plane of the high aperture lens and the reflected radiation measured. By comparing the illumination profile and the detected radiation it is possible to determine the transmission losses for S and P polarisation which can then be used in scatterometry modeling.

Abstract: A lithographic apparatus of the scanning type in which reticle masking blades 7 are opened at the beginning of a scan. Means are provided to compensate for an increase in the intensity density of the illumination beam as the reticle masking blades are opened. These means may comprise lamp control means 10 for controlling a compensating decrease in the lamp intensity. The reticle masking blades 70 may be manufactured of, e.g., quartz and provided with a reflective rear coating, e.g. of aluminum, so that portions of the illumination beam intercepted by the reticle masking blades are totally internally reflected.