Patents by Inventor Wiliam P. Kornrumpf

Wiliam P. Kornrumpf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ultrasonic array with a high density of electrical connections
    Patent number: 5091893
    Abstract: A piezoelectric ultrasonic array transducer has its individual elements connected to external electronics via a high density interconnect structure which facilitates signal connection and uniformity from array-to-array. The array fabrication process is preferably modified for use with a high density interconnect structure in order to obtain maximum transducer quality.
    Type: Grant
    Filed: April 5, 1990
    Date of Patent: February 25, 1992
    Assignee: General Electric Company
    Inventors: Lowell S. Smith, Charles W. Eichelberger, Robert J. Wojnarowksi, Wiliam P. Kornrumpf, Joseph E. Piel, Jr.