Abstract: A method is provided for simultaneously forming electrical circuitry and functional light structures on a curable lacquer layer deposited on a base substrate of an optoelectronic device. The method includes contacting a transfer substrate against the curable lacquer layer. The transfer substrate has a mating surface with the electrical circuitry on a first portion and negative impressions of the functional light structures on a second portion. The electrical circuitry is releasably adhered to the mating surface, and adhesion between the transfer substrate and the electrical circuitry is substantially lesser than adhesion between the electrical circuitry and the curable lacquer layer. So, contacting enables simultaneous embedding of the electrical circuitry and replication of the functional light structures onto the curable lacquer layer.