Patents by Inventor Wiljee Carino

Wiljee Carino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for determining and dispensing resin for a compression molding process flow
    Patent number: 9011127
    Abstract: The present disclosure is directed to a system and method for forming a plurality of packaged dice on a carrier, the carrier including a storage medium configured to store an indication of a total number of unpackaged dice on the carrier. The forming includes providing a quantity of molding compound to a molding module based on the total number of the unpackaged dice on the carrier. The providing includes accessing the indication of the total number of the unpackaged dice on the carrier from the storage medium, determining the quantity of molding compound based on the indication of the total number of unpackaged dice on the carrier, and molding the unpackaged dice into the packaged dice using the quantity of molding compound.
    Type: Grant
    Filed: August 15, 2012
    Date of Patent: April 21, 2015
    Assignee: STMicroelectronics Inc.
    Inventors: Wiljee Carino, Bernie Chrisanto Ang, Richard Laylo
  • METHOD AND SYSTEM FOR DETERMINING AND DISPENSING RESIN FOR A COMPRESSION MOLDING PROCESS FLOW
    Publication number: 20140048976
    Abstract: The present disclosure is directed to a system and method for forming a plurality of packaged dice on a carrier, the carrier including a storage medium configured to store an indication of a total number of unpackaged dice on the carrier. The forming includes providing a quantity of molding compound to a molding module based on the total number of the unpackaged dice on the carrier. The providing includes accessing the indication of the total number of the unpackaged dice on the carrier from the storage medium, determining the quantity of molding compound based on the indication of the total number of unpackaged dice on the carrier, and molding the unpackaged dice into the packaged dice using the quantity of molding compound.
    Type: Application
    Filed: August 15, 2012
    Publication date: February 20, 2014
    Applicant: STMICROELECTRONICS INC.
    Inventors: Wiljee Carino, Bernie Chrisanto Ang, Richard Laylo