Abstract: An organizer assembly includes a primary basket extending along a longitudinal axis between a first open end and a second closed end. The organizer assembly includes a backplate extending between a front wall and a rear wall, wherein a plurality of entry/exit slots are defined at the rear wall. The backplate further includes a plurality of positioning assemblies. The organizer assembly includes a hinge assembly connecting the backplate to the primary basket, wherein the backplate is rotatable relative to the primary basket at the hinge assembly about a lateral axis. The organizer assembly includes a plurality of organizer trays, each of the plurality of organizer trays rotatably connectable to the backplate at one of the plurality of positioning assemblies. Each of the plurality of positioning assemblies causes the connected one of the plurality of organizer trays to be selectively positionable in one of a plurality of rotational positions.

Abstract: A power supply assembly includes a dielectric substrate and a power supply circuit supported by the dielectric substrate. A conductive connection block is attached to the dielectric substrate at a main surface thereof and is connected to a power supply terminal of the power supply circuit. A spring probe pin is fitted in a bore formed in the connection block and includes a conductive sleeve and a conductive plunger fitted in the sleeve. The conductive sleeve is in electrically conductive contact with the connection block.

Abstract: A test head for a semiconductor integrated circuit tester includes a main support structure defining a device interface board location, and a contact support frame that is displaceable relative to the main support structure for engaging a device interface board at the device interface board location.

Abstract: A test head for a semiconductor integrated circuit tester includes a main support structure defining a device interface board location, and a contact support frame that is displaceable relative to the main support structure for engaging a device interface board at the device interface board location.

Abstract: A power supply assembly includes a dielectric substrate and a power supply circuit supported by the dielectric substrate. A conductive connection block is attached to the dielectric substrate at a main surface thereof and is connected to a power supply terminal of the power supply circuit. A spring probe pin is fitted in a bore formed in the connection block and includes a conductive sleeve and a conductive plunger fitted in the sleeve. The conductive sleeve is in electrically conductive contact with the connection block.

Abstract: A test head for a semiconductor integrated circuit tester, the test head includes a power supply board mounted to a power distribution board and positioned between the power distribution board and a device interface board. The power supply board includes a power supply circuit having power supply input terminals for receiving electrical power at a voltage Vin and force and return terminals for supplying regulated electrical power at a voltage Vout. The power supply board further includes a power connector for connecting the force and return terminals of the power supply circuit to power supply contact elements of the device interface board.

Abstract: A portable wire dispenser is provided having an adjustable frictional drag to prevent overspinning of the spool or spools carried by the dispenser. One or more frictional collars are carried by the same shaft that carries the wire spool or spools. The frictional collar engages the side of one or both hubs of each wire spool. Each frictional collar preferably carries a wavespring on one or both faces of the collar. The wavespring allows the use of adjustable frictional drag applied to the hubs of each spool.

Abstract: An interconnection structure includes a positioning block and a dielectric substrate. A coaxial cable has an end segment that is fitted in a passage in the positioning block and the positioning block is so positioned relative to the dielectric substrate that an end face of the inner conductor of the coaxial cable is presented towards a conductive element on a main face of the substrate. A discrete resilient contact element is interposed between the end face of the inner conductor and the conductive element and in electrically-conductive pressure contact with both the inner conductor and the conductive element.

Abstract: An interconnection structure includes a positioning block and a dielectric substrate. A coaxial cable has an end segment that is fitted in a passage in the positioning block and the positioning block is so positioned relative to the dielectric substrate that an end face of the inner conductor of the coaxial cable is presented towards a conductive element on a main face of the substrate. A discrete resilient contact element is interposed between the end face of the inner conductor and the conductive element and in electrically-conductive pressure contact with both the inner conductor and the conductive element.

Abstract: A test head for a semiconductor integrated circuit tester, the test head includes a power supply board mounted to a power distribution board and positioned between the power distribution board and a device interface board. The power supply board includes a power supply circuit having power supply input terminals for receiving electrical power at a voltage Vin and force and return terminals for supplying regulated electrical power at a voltage Vout. The power supply board further includes a power connector for connecting the force and return terminals of the power supply circuit to power supply contact elements of the device interface board.