Abstract: An RFID tag (1) comprises a substrate (2), an inlay (3), an antenna (4) and an integrated circuit on a chip (5) coupled to the antenna (4). The substrate (2) has a front surface (6), a back surface (7), a first side edge (8) and a second side edge (9). The inlay (3) comprises the antenna (4) and has a fold (10) that is configured to fold over one side edge (8, 9) of the substrate (2) from the front surface (6) to the back surface (7). At least the inlay (3) comprises at least one opening (12).

Abstract: An RFID tag (1) comprises a substrate (2), an inlay (3), an antenna (4) and an integrated circuit on a chip (5) coupled to the antenna (4). The substrate (2) has a front surface (6), a back surface (7), a first side edge (8) and a second side edge (9). The inlay (3) comprises the antenna (4) and has a fold (10) that is configured to fold over one side edge (8, 9) of the substrate (2) from the front surface (6) to the back surface (7). At least the inlay (3) comprises at least one opening (12).

Abstract: The present invention relates to an RFID tag (11) that has a front side and a back side. The RFID tag (11) comprises a printable surface (13), an antenna (2) and an integrated circuit on a chip (4) electrically connected to the antenna (2). The RFID tag comprises a dielectric substrate (1), a dielectric layer (7) and a ground plane (3) under the substrate (1). The substrate (1) has a first side and a second side. The substrate (1) comprises an antenna (2) on the first side of the substrate (1). The antenna (2) and the ground plane (3) are configured to overlap. The substrate (1) is folded over at least one edge (7a; 7b) of the dielectric layer (7) in such a manner that the ground plane (3) is configured to cover the antenna (2) on the back side of the RFID tag (11).