Patents by Inventor Will O'Reilly

Will O'Reilly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7798612
    Abstract: A microfluidic architecture is disclosed. The microfluidic architecture includes a substrate having an edge and a thin film stack established on at least a portion of the substrate adjacent the edge. The thin film stack includes a non-conducting layer and a seed layer, where the seed layer is positioned such that a portion of the non-conducting layer is exposed. A chamber layer is established on at least a portion of the seed layer. The non-conducting layer, the seed layer, and the chamber layer define a microfluidic chamber. A layer having a predetermined surface property is electroplated on the chamber layer and on at least one of another portion of the seed layer and the exposed portion of the non-conducting layer.
    Type: Grant
    Filed: April 24, 2008
    Date of Patent: September 21, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Mohammed S. Shaarawi, Kenneth Hickey, Will O'Reilly
  • Publication number: 20080198202
    Abstract: A microfluidic architecture is disclosed. The microfluidic architecture includes a substrate having an edge and a thin film stack established on at least a portion of the substrate adjacent the edge. The thin film stack includes a non-conducting layer and a seed layer, where the seed layer is positioned such that a portion of the non-conducting layer is exposed. A chamber layer is established on at least a portion of the seed layer. The non-conducting layer, the seed layer, and the chamber layer define a microfluidic chamber. A layer having a predetermined surface property is electroplated on the chamber layer and on at least one of another portion of the seed layer and the exposed portion of the non-conducting layer.
    Type: Application
    Filed: April 24, 2008
    Publication date: August 21, 2008
    Inventors: Mohammed Shaarawi, Kenneth Hickey, Will O'Reilly
  • Patent number: 7387370
    Abstract: A microfluidic architecture is disclosed. The microfluidic architecture includes a substrate having an edge and a thin film stack established on at least a portion of the substrate adjacent the edge. The thin film stack includes a non-conducting layer and a seed layer, where the seed layer is positioned such that a portion of the non-conducting layer is exposed. A chamber layer is established on at least a portion of the seed layer. The non-conducting layer, the seed layer, and the chamber layer define a microfluidic chamber. A layer having a predetermined surface property is electroplated on the chamber layer and on at least one of another portion of the seed layer and the exposed portion of the non-conducting layer.
    Type: Grant
    Filed: April 4, 2005
    Date of Patent: June 17, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Mohammed S. Shaarawi, Kenneth Hickey, Will O'Reilly
  • Publication number: 20050243142
    Abstract: A microfluidic architecture is disclosed. The microfluidic architecture includes a substrate having an edge and a thin film stack established on at least a portion of the substrate adjacent the edge. The thin film stack includes a non-conducting layer and a seed layer, where the seed layer is positioned such that a portion of the non-conducting layer is exposed. A chamber layer is established on at least a portion of the seed layer. The non-conducting layer, the seed layer, and the chamber layer define a microfluidic chamber. A layer having a predetermined surface property is electroplated on the chamber layer and on at least one of another portion of the seed layer and the exposed portion of the non-conducting layer.
    Type: Application
    Filed: April 4, 2005
    Publication date: November 3, 2005
    Inventors: Mohammed Shaarawi, Kenneth Hickey, Will O'Reilly