Patents by Inventor Willaim A. Wojtczak

Willaim A. Wojtczak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing slurries for copper and associated materials
    Patent number: 7427567
    Abstract: A chemical mechanical polishing slurry and method for using the slurry for polishing copper, barrier material and dielectric material that includes a first and second slurry. The first slurry has a high removal rate on copper and a low removal rate on barrier material. The second slurry has a high removal rate on barrier material and a low removal rate on copper and dielectric material. The first and second slurries can include silica particles, an oxidizing agent, a corrosion inhibitor, and a cleaning agent.
    Type: Grant
    Filed: June 6, 2005
    Date of Patent: September 23, 2008
    Assignee: Advanced Technology Materials, Inc.
    Inventors: Willaim A. Wojtczak, Thomas H. Baum, Long Nguyen, Cary Regulski