Patents by Inventor Willard E. Conley, Jr.

Willard E. Conley, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for producing a positive pattern utilizing naphtho quinone diazide compound having non-metallic atom directly bonded to the naphthalene ring
    Patent number: 5567569
    Abstract: Quinone diazo compounds having bonded to the diazo ring or directly bonded to a ring of the compound, certain non-metallic atoms that improve the photosensitivity thereof are provided. These quinone diazo compounds are useful as photoactive compounds in photoresist compositions, and particularly positive photoresist composition employed in x-ray or electron beam radiation. Also provided is a method for preparing compounds of the present invention.
    Type: Grant
    Filed: March 15, 1996
    Date of Patent: October 22, 1996
    Assignee: International Business Machines Corporation
    Inventors: Ari Aviram, William R. Brunsvold, Daniel Bucca, Willard E. Conley, Jr., David E. Seeger
  • Positive resist composition containing naphthoquinonediazide compound having non-metallic atom directly bonded to the naphthalene ring
    Patent number: 5552256
    Abstract: Quinone diazo compounds having bonded to the diazo ring or directly bonded to a ring of the compound, certain non-metallic atoms that improve the photosensitivity thereof are provided. These quinone diazo compounds are useful as photoactive compounds in photoresist compositions, and particularly positive photoresist composition employed in x-ray or electron beam radiation. Also provided is a method for preparing compounds of the present invention.
    Type: Grant
    Filed: September 29, 1994
    Date of Patent: September 3, 1996
    Assignee: International Business Machines Corporation
    Inventors: Ari Aviram, William R. Brunsvold, Daniel Bucca, Willard E. Conley, Jr., David E. Seeger
  • Highly sensitive dry developable deep UV photoresist
    Patent number: 5023164
    Abstract: Highly sensitive, highly absorbing deep ultraviolet and vacuum ultraviolet resists which comprise a novolak resin protected with an acid labile group and a photoinitiator which generates a strong acid upon exposure to deep ultraviolet or vacuum ultraviolet radiation. The exposed resists are reacted with organometallic compounds to form reactive ion etch resistant patterns.
    Type: Grant
    Filed: October 23, 1989
    Date of Patent: June 11, 1991
    Assignee: International Business Machines Corporation
    Inventors: William R. Brunsvold, Philip Chiu, Willard E. Conley, Jr., Dale M. Crockatt, Melvin W. Montgomery, Wayne M. Moreau