Patents by Inventor Willard F. Amero, Jr.

Willard F. Amero, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Weldless surface mounted interconnect
    Patent number: 5250371
    Abstract: A weldless battery pack (10) comprises a housing (14) having a flexible circuit (16) inserted within the housing. The flexible circuit has at least one spring contact (20) integrally formed on the flexible circuit. Inside the housing is a plurality of cells (12) interconnected by at least one of the spring contacts (20) formed on the flexible circuit.
    Type: Grant
    Filed: December 24, 1991
    Date of Patent: October 5, 1993
    Assignee: Motorola, Inc.
    Inventors: Raymond J. Kleinert, III, John H. Hackenberg, Russell E. Gyenes, Willard F. Amero, Jr.