Abstract: A wafer-handling apparatus for semiconductor wafers, the apparatus including a holding structure having wedge assemblies configured to hold and rotate a wafer about a first axis, the first axis extending generally perpendicular to a surface of the wafer. Further, a shaft is operatively coupled to the holding structure and configured to rotate the holding structure about a second axis, the second axis different than the first axis.

Abstract: A method for plasma etching a wafer in a process chamber. The wafer is coupled to an internally cooled chuck and is rotated therewith. In the case of electrostatic coupling of the wafer to the chuck, the bias applied to the chuck may be coupled with the use of a rotational roller to allow the bias to be applied to the chuck for the duration of the etch process. Plasma is introduced into the chamber to etch the rotating wafer. A spider assembly is disposed in the chamber so that the spider pushes up on the wafer in response to actuation of a lift mechanism upon completion of the etching process.

Abstract: A method for inspecting semiconductor wafers. Specifically, an arm which is constructed to hold a wafer, is mounted on a rotational device to provide a user with the means of inspecting a wafer in any position without having to physically touch the wafer or move the wafer to another inspection station. The arm provides rotation about an axis parallel to the surface of the wafer, as well as rotation about an axis run which is perpendicular to the surface of the wafer and extends through the axial center of the wafer.

Abstract: A method for fabricating semiconductor wafers. Specifically, an arm which is constructed to hold a wafer, is mounted on a rotational device to provide a user with the means of inspecting a wafer in any position without having to physically touch the wafer or move the wafer to another inspection station. The arm provides rotation about an axis parallel to the surface of the wafer, as well as rotation about an axis run which is perpendicular to the surface of the wafer and extends through the axial center of the wafer.