Abstract: A multi-dimensional solid state lighting (SSL) device array system and method are disclosed. An SSL device includes a support, a pillar having several sloped facets mounted to the support, and a flexible substrate pressed against the pillar. The substrate can carry a plurality of solid state emitters (SSEs) facing in various directions corresponding to the sloped facets of the pillar. The flexible substrate can be a flat substrate prepared using planar mounting techniques, such as wirebonding techniques, before bending the substrate against the pillar.

Abstract: A multi-dimensional solid state lighting (SSL) device array system and method are disclosed. An SSL device includes a support, a pillar having several sloped facets mounted to the support, and a flexible substrate pressed against the pillar. The substrate can carry a plurality of solid state emitters (SSEs) facing in various directions corresponding to the sloped facets of the pillar. The flexible substrate can be a flat substrate prepared using planar mounting techniques, such as wirebonding techniques, before bending the substrate against the pillar.

Abstract: A multi-dimensional solid state lighting (SSL) device array system and method are disclosed. An SSL device includes a support, a pillar having several sloped facets mounted to the support, and a flexible substrate pressed against the pillar. The substrate can carry a plurality of solid state emitters (SSEs) facing in various directions corresponding to the sloped facets of the pillar. The flexible substrate can be a flat substrate prepared using planar mounting techniques, such as wirebonding techniques, before bending the substrate against the pillar.

Abstract: A multi-dimensional solid state lighting (SSL) device array system and method are disclosed. An SSL device includes a support, a pillar having several sloped facets mounted to the support, and a flexible substrate pressed against the pillar. The substrate can carry a plurality of solid state emitters (SSEs) facing in various directions corresponding to the sloped facets of the pillar. The flexible substrate can be a flat substrate prepared using planar mounting techniques, such as wirebonding techniques, before bending the substrate against the pillar.

Abstract: A method for inspecting semiconductor wafers. Specifically, an arm which is constructed to hold a wafer, is mounted on a rotational device to provide a user with the means of inspecting a wafer in any position without having to physically touch the wafer or move the wafer to another inspection station. The arm provides rotation about an axis parallel to the surface of the wafer, as well as rotation about an axis run which is perpendicular to the surface of the wafer and extends through the axial center of the wafer.

Abstract: A method for fabricating semiconductor wafers. Specifically, an arm which is constructed to hold a wafer, is mounted on a rotational device to provide a user with the means of inspecting a wafer in any position without having to physically touch the wafer or move the wafer to another inspection station. The arm provides rotation about an axis parallel to the surface of the wafer, as well as rotation about an axis run which is perpendicular to the surface of the wafer and extends through the axial center of the wafer.

Abstract: A method utilizing a plasma etching machine which comprises a process chamber defining an interior region and including a bottom wall having an aperture and a block disposed in the aperture and including a longitudinally extending bore. A shaft extends through the bore and includes a spider push rod extending longitudinally therethrough. An internally cooled chuck is coupled to the shaft and disposed in the interior region and cooperates with the shaft to define a chamber. A spider is disposed in the chamber and is coupled to the push rod. A lift mechanism is coupled to the shaft and the push rod so that the spider pushes up on a wafer in response to actuation of the lift mechanism. A wafer clamping mechanism is coupled to the push rod if a mechanical clamp is used. In the case of electrostatic clamp the bias applied to the chuck is coupled with the use of a rotational roller to allow the bias to be applied to the chuck for the duration of the etch process. A RF source is needed for ionization of the gas.

Abstract: A method and apparatus for inspecting semiconductor wafers. Specifically, an arm which is constructed to hold a wafer, is mounted on a rotational device to provide a user with the means of inspecting a wafer in any position without having to physically touch the wafer or move the wafer to another inspection station. The arm provides rotation about an axis parallel to the surface of the wafer, as well as rotation about an axis run which is perpendicular to the surface of the wafer and extends through the axial center of the wafer.

Abstract: A method of inverting a plurality of plate-like materials. One form of the method may include supporting the plurality of plate-like materials in an orientation such that the plate-like materials are substantially parallel to each other in a first orientation. The method may also include engaging portions of each plate-like material to retain the plate-like materials in the substantially parallel orientation to each other, and simultaneously inverting the plate-like material to a second orientation.

Abstract: An apparatus and method for inverting a plurality of plate-like materials to provide for the treatment of plate-like material using techniques that must be applied to the surface from a direction other than from above the material, such as for beneath the material in meniscus coating techniques. The apparatus includes a base, a back attached to the base, a top that is removably attachable to the base for retaining a cassette between the top and the base and retractable material holders attached to the base for engaging and disengaging the plate-like material. In a preferred embodiment, the retractable material holders are in the form of support blocks having notches corresponding the edges of the plate-like material that are reciprocally moved by a side actuator to enable the blocks to engage and disengage the plate-like material.

Abstract: A plasma etching machine comprises a process chamber defining an interior region and including a bottom wall having an aperture and a block disposed in the aperture and including a longitudinally extending bore. A shaft extends through the bore and includes a spider push rod extending longitudinally therethrough. An internally cooled chuck is coupled to the shaft and disposed in the interior region and cooperates with the shaft to define a chamber. A spider is disposed in the chamber and is coupled to the push rod. A lift mechanism is coupled to the shaft and the push rod so that the spider pushes up on a wafer in response to actuation of the lift mechanism. A wafer clamping mechanism is coupled to the push rod if a mechanical clamp is used. In the case of electrostatic clamp the bias applied to the chuck is coupled with the use of a rotational roller to allow the bias to be applied to the chuck for the duration of the etch process. A RF source is needed for ionization of the gas.

Abstract: An apparatus and method for inverting a plurality of plate-like materials to provide for the treatment of plate-like material using techniques that must be applied to the surface from a direction other than from above the material, such as from beneath the material in meniscus coating techniques. The apparatus includes a base, a back attached to the base, a top that is removably attachable to the base for retaining a cassette between the top and the base and retractable material holders attached to the base for engaging and disengaging the plate-like material. In a preferred embodiment, the retractable material holders are in the form of support blocks having notches corresponding the edges of the plate-like material that are reciprocally moved by a side actuator to enable the blocks to engage and disengage the plate-like material.

Abstract: A detachable locking device is described which consists of a pair of standard box end wrenches with shortened handles having integral ears on the ends of the handles with openings therethrough. The wrenches are designed to be retrofittably placed behind the respective connecting nuts on the line termination point adapter assemblies which are to be joined. The preliminary connection and seal are made using conventional means and the connecting nuts are torqued to near their optimum value. The wrench heads of the locking device are then positioned on the nuts so that a connecting bolt can be passed through the openings in the ears on the handles, a nut attached thereto and then tightened to hold and secure the connecting nuts together and prevent the nuts from loosening or seal leaking during the operation of the fluid transmission line.

Abstract: A removable clamping device is described which uniformly and effectively joins two fluid transmission lines at their normal termination points, using standard adapter flanges and removable seals and generally "C" shaped clamps having narrow slots therein which are designed to just slip over the smallest diameter of the adapter or fluid line and bear against the respective connecting flanges. The two clamps are held together by threaded bolts which are spaced equally about the clamps and which may be tightened or loosened without exerting undesirable rotational torque about the long axis of the fluid line connection, thus avoiding possible breakage and leakage.

Abstract: A detachable locking device is described which consists of a pair of standard box end wrenches with shortened handles having integral ears on the ends of the handles with openings therethrough. The wrenches are first placed behind the respective connecting nuts on the line termination point adapter assemblies which are to be joined. The preliminary connection and seal is then made using conventional methods and the connecting nuts are torqued to near their optimum value. The box end wrenches of the locking device are then positioned on the nuts so that a connecting bolt can be passed through the openings in the ears on the handles, a nut attached thereto and then tightened to hold and secure the connecting nuts together and prevent the nuts from loosening or seal leaking during the operation of the fluid transmission line.

Abstract: An improved apparatus is described for the closure of the open end of a conventional tube furnace used in the treatment of semiconductor devices manufactured in the integrated circuit industry. The apparatus consists primarily of an adjustable fixed weight on one end of a lever arm and a roller bearing means on the other end, said lever arm being supported by a fulcrum structure which is adjustably attached to the movable track which transports the semiconductor devices into and out of the furnace. The roller bearing end of the lever arm rests with constant pressure against the rear face of the furnace door when the door is closed and held against the opening in the tube furnace. The design eliminates the need for springs and is insensitive to the environment.