Abstract: Heat pipes are employed in conjunction with flexible flap thermal conductors to provide a mechanism for cooling high-powered electronic circuit chip modules which cannot otherwise be cooled by conventional means because of their non-coplanarity and their inaccessibility. More particularly, the present invention provides a mechanism for cooling electronic circuit chip modules which are disposed on circuit boards which are in close proximity to one another which fact precludes air cooling of heat sink structures and/or the imposition of a liquid-cooled cold plate due to the non-coplanarity and/or due to the inaccessibility.