Patents by Inventor Willi HENKENJOHANN

Willi HENKENJOHANN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesion promoter compositions and primer compositions for metal-plastic hybrid components
    Patent number: 11078390
    Abstract: The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: August 3, 2021
    Assignees: Evonik Operations GmbH, SI-Coatings GmbH
    Inventors: Willi Henkenjohann, Karl Kuhmann, Maximilian Gruhn, Andreas Pawlik, Martin Risthaus, Klaus Welsch, Sven Mang
  • ADHESION PROMOTER COMPOSITIONS AND PRIMER COMPOSITIONS FOR METAL-PLASTIC HYBRID COMPONENTS
    Publication number: 20190185724
    Abstract: The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.
    Type: Application
    Filed: February 22, 2019
    Publication date: June 20, 2019
    Applicants: Evonik Degussa GmbH, SI-Coatings GmbH
    Inventors: Willi Henkenjohann, Karl Kuhmann, Maximilian Gruhn, Andreas Pawlik, Martin Risthaus, Klaus Welsch, Sven Mang
  • Adhesion promoter compositions and primer compositions for metal-plastic hybrid components
    Patent number: 10273390
    Abstract: The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: April 30, 2019
    Assignees: Evonik Degussa GmbH, SI-Coatings GmbH
    Inventors: Willi Henkenjohann, Karl Kuhmann, Maximilian Gruhn, Andreas Pawlik, Martin Risthaus, Klaus Welsch, Sven Mang
  • ADHESION PROMOTER COMPOSITIONS AND PRIMER COMPOSITIONS FOR METAL-PLASTIC HYBRID COMPONENTS
    Publication number: 20150361316
    Abstract: The invention provides an adhesion promoter composition comprising at least one polymer A selected from at least one epoxy resin-phenol resin precondensate, a mixture of at least one epoxy resin-phenol resin precondensate and epoxy resins, a mixture of epoxy resins and phenol resins, polyamide resins and mixtures thereof, and at least one copolyamide-based hotmelt adhesive. Additionally described is a primer composition comprising at least one polymer B selected from saturated polyester resins, epoxy-phenol resin precondensates, mixtures of epoxy resins and phenol resins, and mixtures thereof, at least one crosslinker resin selected from the group consisting of melamine resins, blocked isocyanate resins and mixtures thereof, at least one catalyst, and at least one copolyamide-based hotmelt adhesive.
    Type: Application
    Filed: January 29, 2014
    Publication date: December 17, 2015
    Applicants: Evonik Degussa GmbH, SI-Coating GmbH
    Inventors: Willi HENKENJOHANN, Karl KUHMANN, Maximilian GRUHN, Andreas PAWLIK, Martin RISTHAUS, Klaus WELSCH, Sven MANG