Patents by Inventor Willi Malikowsik

Willi Malikowsik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Soft-solder alloy for bonding ceramic articles
    Patent number: 4797328
    Abstract: Soft-solder alloys for connecting ceramic parts without permetallization comprising 86 to 99% lead or tin, 0 to 13% silver and/or copper, 0 to 10% indium and 1 to 10% titanium and/or zirconium.
    Type: Grant
    Filed: February 17, 1987
    Date of Patent: January 10, 1989
    Assignee: Degussa Aktiengesellschaft
    Inventors: Wolfgang Boehm, Juergen Hausselt, Wolfgang Weise, Willi Malikowsik