Patents by Inventor William A. Balla

William A. Balla has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated passive and active seismic surveying using multiple arrays
    Patent number: 10061046
    Abstract: Microseismic mapping using buried arrays with the integration of passive and active seismic surveys provides enhanced microseismic mapping results. The system is initially set up by recording seismic data with the buried array installation while shooting a significant portion of the 3D surface seismic survey. The 3D surface seismic survey provides the following data: shallow 3D VSP data from the buried arrays; P-wave and converted wave data for the area covered by the buried array that benefits from the planned data integration processing effort; and microseismic data and associated analysis.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: August 28, 2018
    Assignee: ION Geophysical Corporation
    Inventors: Gregg S. Hofland, Jacques P. Leveille, Daniel S. Kahn, Kees Faber, Rick Laroo, Jerry L. Lawson, William A. Balla, Michael J. Saur
  • Integrated passive and active seismic surveying using multiple arrays
    Patent number: 9448313
    Abstract: Microseismic mapping using buried arrays with the integration of passive and active seismic surveys provides enhanced microseismic mapping results. The system is initially set up by recording seismic data with the buried array installation while shooting a significant portion of the 3D surface seismic survey. The 3D surface seismic survey provides the following data: shallow 3D VSP data from the buried arrays; P-wave and converted wave data for the area covered by the buried array that benefits from the planned data integration processing effort; and microseismic data and associated analysis.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: September 20, 2016
    Assignee: ION Geophysical Corporation
    Inventors: Gregg S. Hofland, Jacques P. Leveille, Daniel S. Kahn, Kees Faber, Rick Laroo, Jerry L. Lawson, William A. Balla, Michael J. Saur
  • Integrated Passive and Active Seismic Surveying Using Multiple Arrays
    Publication number: 20130215716
    Abstract: Microseismic mapping using buried arrays with the integration of passive and active seismic surveys provides enhanced microseismic mapping results. The system is initially set up by recording seismic data with the buried array installation while shooting a significant portion of the 3D surface seismic survey. The 3D surface seismic survey provides the following data: shallow 3D VSP data from the buried arrays; P-wave and converted wave data for the area covered by the buried array that benefits from the planned data integration processing effort; and microseismic data and associated analysis.
    Type: Application
    Filed: February 5, 2013
    Publication date: August 22, 2013
    Inventors: Gregg S. Hofland, Jacques P. Leveille, Daniel S. Kahn, Kees Faber, Rick Laroo, Jerry L. Lawson, William A. Balla, Michael J. Saur
  • Integrated Passive and Active Seismic Surveying Using Multiple Arrays
    Publication number: 20130215717
    Abstract: Microseismic mapping using buried arrays with the integration of passive and active seismic surveys provides enhanced microseismic mapping results. The system is initially set up by recording seismic data with the buried array installation while shooting a significant portion of the 3D surface seismic survey. The 3D surface seismic survey provides the following data: shallow 3D VSP data from the buried arrays; P-wave and converted wave data for the area covered by the buried array that benefits from the planned data integration processing effort; and microseismic data and associated analysis.
    Type: Application
    Filed: February 5, 2013
    Publication date: August 22, 2013
    Inventors: Gregg S. Hofland, Jacques P. Leveille, Daniel S. Kahn, Kees Faber, Rick Laroo, Jerry L. Lawson, William A. Balla, Michael J. Saur